An aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water. Such cleaning compositions are effective to remove residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures with little corrosion of copper and attack of dielectric substrates.
一种
水基清洗组合物,包括烷醇胺、四烷基氢氧化
铵、非
金属
氟化盐、腐蚀
抑制剂,如
抗坏血酸或其单独或组合的衍
生物,以及平衡
水。这种清洗组合物在低温下可有效去除等离子工艺产生的有机物、
金属有机物、
无机盐、氧化物、氢氧化物或络合物与有机光刻胶膜结合或不与有机光刻胶膜结合的残留物,对
铜的腐蚀和对电介质基底的侵蚀很小。