Resin compositions comprising :
(A) 10-80 parts by weight of a polyphenylene ether resin,
(B) 90-20 parts by weight of a polyamide resin, and
(C) 3-70 parts by weight of an inorganic filler whereby :
(1) the average particle size is no more than 5 µm and the aspect ratio is at least 3, and
(2) the difference in the crystallization initiation temperature of a composition comprising 90 wt% of polyamide resin and 10 wt% of inorganic filler, and the crystallization initiation temperature of the polyamide resin is no more than 5°C, have excellent surface smoothness; a high rigidity, a small linear expansion coefficient, good impact resistance, heat resistance and chemical resistance.
树脂组合物,包括 :
(A) 10-80 份(按重量计)聚苯醚
树脂、
(B) 90-20 份(按重量计)聚酰胺
树脂,以及
(C) 3-70 份(按重量计)无机填料,其中:
(1) 平均粒径不超过 5 微米,长宽比至少为 3,以及
(2) 由 90 wt%的聚酰胺
树脂和 10 wt%的无机填料组成的组合物的结晶起始温度与聚酰胺
树脂的结晶起始温度之差不超过 5°C。