申请人:FUJIFILM Corporation
公开号:EP3603966A1
公开(公告)日:2020-02-05
Provided are a resin molded body and applications thereof. The resin molded body includes a resin layer containing a resin and a compound represented by Formula (1), and on at least one surface of the resin layer, a protective layer that contains at least one substance selected from the group consisting of urethane resin, acrylic resin, and polysiloxane. In Formula (1), Het1 represents a divalent 5-membered or 6-membered aromatic heterocyclic residue. Xa, Xb, Xc, and Xd each independently represent a hetero atom, and Ya, Yb, Yc, Yd, Ye, and Yf each independently represent a hetero atom or a carbon atom. A ring bonded to Het1 may have a double bond at any position.
本文提供了一种树脂模塑体及其应用。 该树脂模塑体包括含有树脂和由式(1)表示的化合物的树脂层,以及在树脂层的至少一个表面上含有至少一种从聚氨酯树脂、丙烯酸树脂和聚硅氧烷组成的组中选出的物质的保护层。 在式(1)中,Het1 代表二价 5 元或 6 元芳香杂环残基。 Xa、Xb、Xc 和 Xd 各自独立地代表杂原子,Ya、Yb、Yc、Yd、Ye 和 Yf 各自独立地代表杂原子或碳原子。 与 Het1 结合的环可以在任何位置具有双键。