Cross-linked liquid crystalline polybenzoxazines bearing cholesterol-based mesogen side groups
作者:Ying Liu、Jiming Chen、Yongxin Qi、Sheng Gao、Krishnasamy Balaji、Yaoheng Zhang、Qingbin Xue、Zaijun Lu
DOI:10.1016/j.polymer.2018.05.004
日期:2018.6
obtained through thermally induced ring-opening polymerization of the benzoxazine ring. The study results show that BA-ac is a monotropic smectic C liquid crystal, and poly(BA-ac) contains a smectic C phase structure. The formation of the liquidcrystalline structure of poly(BA-ac) is mainly caused by the strong ability of cholesterol-based mesogen to form liquid crystals and its position on the side group
Enantioselective Arylcyanation of Styrenes
<i>via</i>
<scp>Copper‐Catalyzed</scp>
Radical Relay
<sup>†</sup>
作者:Weiwen Zhuang、Pinhong Chen、Guosheng Liu
DOI:10.1002/cjoc.202000494
日期:2021.1
The first copper‐catalyzedenantioselective arylcyanation of styrenes has been developed using readily available anilines as aryl radical precursors under mild conditions, which enables easy access to chiral 2,3‐diaryl propionitriles with moderate to good enantioselectivities. This operationally straightforward reaction exhibits broad substrate scope and functional group tolerance. Notably, this method
COMPOSITION AND METHOD FOR TEMPORARILY FIXING SOLID
申请人:JSR Corporation
公开号:EP1522567A1
公开(公告)日:2005-04-13
The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.
Composition and method for temporarily fixing solid
申请人:——
公开号:US20040185187A1
公开(公告)日:2004-09-23
The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.