COBALT COMPLEX, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING COBALT-CONTAINING THIN FILM
申请人:TOSOH CORPORATION
公开号:US20220017553A1
公开(公告)日:2022-01-20
To provide a cobalt complex which is liquid at room temperature, useful for producing a cobalt-containing thin film under conditions without using an oxidizing gas.
A cobalt complex represented by the following formula (1):
L
1
-Co-L
2
(1)
wherein L
1
and L
2
represent a unidentate amide ligand of the following formula (A), a bidentate amide ligand of the following formula (B) or a hetero atom-containing ligand of the following formula (C):
wherein R
1
and R
2
represent a C
1-6
alkyl group or a tri(C
1-6
alkyl)silyl group, and the wave line represents a binding site to the cobalt atom;
wherein R
3
represents a tri(C
1-6
alkyl)silyl group, R
4
and R
5
represent a C
1-4
alkyl group, and X represents a C
1-6
alkylene group;
wherein R
6
and R
8
represent a C
1-6
alkyl group, R
7
represents a hydrogen atom or a C
1-4
alkyl group, Y represents an oxygen atom or NR
9
, Z represents an oxygen atom or NR
10
, and R
9
and R
10
independently represent a C
1-6
alkyl group.
METAL ALKOXIDE COMPOUND, THIN-FILM-FORMING MATERIAL, METHOD FOR PRODUCING THIN FILM, AND ALCOHOL COMPOUND
申请人:ADEKA CORPORATION
公开号:US20150175642A1
公开(公告)日:2015-06-25
Disclosed is a metal alkoxide compound having physical properties suitable for a material for forming thin films by CVD, and particularly, a metal alkoxide compound having physical properties suitable for a material for forming metallic-copper thin films. A metal alkoxide compound is represented by general formula (I). A thin-film-forming material including the metal alkoxide compound is described as well. (In the formula, R
1
represents a methyl group or an ethyl group, R
2
represents a hydrogen atom or a methyl group, R
3
represents a C
1-3
linear or branched alkyl group, M represents a metal atom or a silicon atom, and n represents the valence of the metal atom or silicon atom.
ORGANOMETALLIC COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT USING THE SAME
申请人:SAMSUNG ELECTRONICS CO., LTD.
公开号:US20210388010A1
公开(公告)日:2021-12-16
An organometallic compound and a method of manufacturing an integrated circuit (IC) device, the organometallic compound being represented by Formula (I),
一种有机金属化合物和一种制造集成电路(IC)器件的方法,该有机金属化合物由式(I)表示,
ALUMINUM COMPOUND AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
申请人:Samsung Electronics Co., Ltd.
公开号:US20200207790A1
公开(公告)日:2020-07-02
Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.
提供了一种铝化合物以及使用它制造半导体器件的方法。该铝化合物可用公式1表示。
Method For Producing Pyrimidinylpyrazole Compounds
申请人:Fukunishi Hirotada
公开号:US20120283441A1
公开(公告)日:2012-11-08
The present invention provides a method for producing a pyrimidinylpyrazole compound (1), wherein aminoguanidine (2) or its salt is reacted with a β-diketone compound (3) to produce the pyrimidinylpyrazole compound:
wherein R
1
and R
3
are each independently an alkyl group having 1 to 4 carbon atoms, and R
2
is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. The method is excellent in the environmental compatibility and economic efficiency.