Lindsay Smith, John R.; Nagatomi, Eiji; Waddington, David J., Journal of the Chemical Society. Perkin Transactions 2 (2001), 2000, # 11, p. 2248 - 2258
PATTERN FORMING METHOD, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
申请人:FUJIFILM Corporation
公开号:US20160041465A1
公开(公告)日:2016-02-11
The pattern forming method includes (1) forming a film using an active light sensitive or radiation sensitive resin composition, (2) exposing the film to active light or radiation, and (3) developing the exposed film using a developer including an organic solvent, in which the active light sensitive or radiation sensitive resin composition contains a resin (A) having a group which generates a polar group by being decomposed due to the action of an acid, the resin (A) has a phenolic hydroxyl group and/or a phenolic hydroxyl group protected with a group leaving due to the action of an acid, and the developer including the organic solvent contains an additive which forms at least one interaction of an ionic bond, a hydrogen bond, a chemical bond, and a dipole interaction, with the polar group.
Smith, John R. Lindsay; Nagatomi, Eiji; Stead, Angela, Journal of the Chemical Society. Perkin transactions II, 2000, # 6, p. 1193 - 1198
作者:Smith, John R. Lindsay、Nagatomi, Eiji、Stead, Angela、Waddington, David J.、Beviere, Stephane D.
DOI:——
日期:——
Lindsay Smith, John R.; Nagatomi, Eiji; Waddington, David J., Journal of the Chemical Society. Perkin Transactions 2 (2001), 2000, # 11, p. 2248 - 2258
作者:Lindsay Smith, John R.、Nagatomi, Eiji、Waddington, David J.