2-(1-Methylpiperidin-1-ium-1-yl)-1-phenylethanone

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 2-(1-Methylpiperidin-1-ium-1-yl)-1-phenylethanone
• 化学式: C14H20NO+
• 分子量: 218.31
• InChiKey: JKKDUBRLBIPSFH-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.5
• 重原子数：
  16
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.5
• 拓扑面积：
  17.1
• 氢给体数：
  0
• 氢受体数：
  1

文献信息

• THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：EP3162868A1

  公开（公告）日：2017-05-03

  Provided are a thermal base generator which is capable of performing cyclization of a thermosetting resin at a low temperature and with which a thermosetting resin composition having excellent stability can be prepared, a thermosetting resin composition, a cured film, a cured film manufacturing method, and a semiconductor device. The thermal base generator includes at least one selected from an acidic compound which generates a base in a case of being heated to 40°C or higher, and an ammonium salt containing an anion having a pKa1 of 0 to 4 and an ammonium cation. The acidic compound is preferably an ammonium salt and/or a compound represented by the following General Formula (1), in which A1 represents a p-valent organic group, R1 represents a monovalent organic group, L1 represents an (m+1)-valent organic group, m represents an integer of 1 or more, and p represents an integer of 1 or more.

  本发明提供了一种热碱发生器，它能够在低温下对热固性树脂进行环化，并用它制备出稳定性极佳的热固性树脂组合物、热固性树脂组合物、固化膜、固化膜制造方法和半导体设备。 热碱发生器包括至少一种酸性化合物和铵盐，前者在加热到 40°C 或更高温度时产生碱，后者含有 pKa1 为 0 至 4 的阴离子和铵阳离子。酸性化合物最好是铵盐和/或下式（1）所代表的化合物，其中 A1 代表 p 价有机基团，R1 代表一价有机基团，L1 代表 (m+1)- 价有机基团，m 代表 1 或 1 以上的整数，p 代表 1 或 1 以上的整数。
• Ink composition containing a photo-acid and a photo-base generator and processes using them
  申请人：FUJIFILM Corporation

  公开号：EP1702962B1

  公开（公告）日：2008-12-24
• SEALING MATERIAL FOR FLAT PANEL DISPLAY
  申请人：Yamamoto Yugo

  公开号：US20100152315A1

  公开（公告）日：2010-06-17

  A sealing material for a flat panel display contains 100 parts by weight of a compound (A) containing at least one epoxy group in the molecule, and 0.01 to 40 parts by weight of a compound (B) that generates a base upon irradiation. The compound (B) that generates a base upon irradiation is preferably a compound that generates a tertiary amine upon irradiation. The sealing material has favorable curability at low temperature, and a long pot life at room temperature, and does not cause deterioration of display members with ionic components and acids.
• POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION
  申请人：FUJIFILM Corporation

  公开号：US20180079864A1

  公开（公告）日：2018-03-22

  Provided are a photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition. A polyimide precursor composition in which the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole; in General Formula (1-2), A 1 and A 2 each independently represent an oxygen atom or NH, R 111 and R 112 each independently represent a single bond or a divalent organic group, and R 113 and R 114 each independently represent a hydrogen atom or a monovalent organic group.
• PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：US20180118887A1

  公开（公告）日：2018-05-03

  Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.