2,4-bis(4-chlorophenyl)-1H-imidazole | 871707-72-1

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 2,4-bis(4-chlorophenyl)-1H-imidazole
• 英文别名: 2,5-bis(4-chlorophenyl)-1H-imidazole
• CAS: 871707-72-1
• 化学式: C₁₅H₁₀Cl₂N₂
• 分子量: 289.164
• InChiKey: JBKNZOIIBBKHOR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.6
• 重原子数：
  19
• 可旋转键数：
  2
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  28.7
• 氢给体数：
  1
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  2-溴乙酰胺 、 2,4-bis(4-chlorophenyl)-1H-imidazole 在 potassium carbonate 作用下， 以 N,N-二甲基甲酰胺 为溶剂， 以17.3%的产率得到2-(2,4-bis(4-chlorophenyl)-1H-imidazol-1-yl)acetamide
  参考文献：
  名称：

  Design, synthesis, biological evaluation and molecular docking study of 2,4-diarylimidazoles and 2,4-bis(benzyloxy)-5-arylpyrimidines as novel HSP90 N-terminal inhibitors

  摘要：

  DOI：

  10.1080/14756366.2022.2124407
• 作为产物：
  描述：

  1-(4-chlorophenyl)-2-(p-tolylsulfonyloxy)ethanone 、 对氯苯甲脒 以 水 为溶剂， 反应 3.0h， 以63%的产率得到2,4-bis(4-chlorophenyl)-1H-imidazole
  参考文献：
  名称：

  A facile and eco-friendly synthesis of diarylthiazoles and diarylimidazoles in water

  摘要：

  A simple, efficient and high yielding greener protocol for the synthesis of substituted thiazoles and imidazoles is described that utilizes the reaction of readily available alpha-tosyloxy ketones with variety of thioamides/amidines in water. (C) 2011 Elsevier Ltd. All rights reserved.

  DOI：

  10.1016/j.tetlet.2011.02.069

文献信息

• ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION, ADHESIVE FILM FOR SEMICONDUCTOR, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE USING THE SAME
  申请人：LG CHEM, LTD.

  公开号：US20210292618A1

  公开（公告）日：2021-09-23

  The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.
• US6121260A
  申请人：——

  公开号：US6121260A

  公开（公告）日：2000-09-19
• US6515133B1
  申请人：——

  公开号：US6515133B1

  公开（公告）日：2003-02-04
• [EN] ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION, AND SEMICONDUCTOR ADHESIVE FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE, WHICH USE SAME<br/>[FR] COMPOSITION ADHÉSIVE POUR CONNEXION DE CIRCUIT SEMI-CONDUCTEUR, FILM ADHÉSIF SEMI-CONDUCTEUR, PROCÉDÉ DE FABRICATION DE BOÎTIER SEMI-CONDUCTEUR, ET BOÎTIER SEMI-CONDUCTEUR UTILISANT CEUX-CI<br/>[KO] 반도체 회로 접속용 접착제 조성물, 이를 이용한 반도체용 접착 필름, 반도체 패키지 제조방법 및 반도체 패키지
  申请人：LG CHEMICAL LTD

  公开号：WO2020231101A1

  公开（公告）日：2020-11-19

  본 발명은 열가소성 수지; 열경화성 수지; 경화제; 및 특정 구조의 경화 촉매 화합물을 포함하는 반도체 접착용 수지 조성물과 이를 이용한 반도체용 접착 필름, 반도체 패키지 제조방법 및 반도체 패키지에 관한 것이다.