propane-1,2,3-triol;(2R,3R,4R)-2,3,4,5-tetrahydroxypentanal

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: propane-1,2,3-triol;(2R,3R,4R)-2,3,4,5-tetrahydroxypentanal
• 化学式: C8H18O8
• 分子量: 242.22
• InChiKey: BVRQWGKNMDBRFQ-VEGRVEBRSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -4.41
• 重原子数：
  16
• 可旋转键数：
  6
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.88
• 拓扑面积：
  159
• 氢给体数：
  7
• 氢受体数：
  8

文献信息

• ENCAPSULANT MATERIALS AND A METHOD OF MAKING THEREOF
  申请人：MEKTEC MANUFACTURING CORPORATION (THAILAND) LTD

  公开号：US20150056756A1

  公开（公告）日：2015-02-26

  The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.
• US9607916B2
  申请人：——

  公开号：US9607916B2

  公开（公告）日：2017-03-28
• [EN] ENCAPSULANT MATERIALS AND A METHOD OF MAKING THEREOF<br/>[FR] MATIÈRES D'ENCAPSULATION ET PROCÉDÉ DE FABRICATION ASSOCIÉ
  申请人：MEKTEC MFG CORP THAILAND LTD

  公开号：WO2013165324A2

  公开（公告）日：2013-11-07

  The present disclosure relates generally to encapsulant materials, a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates. More specifically, the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof. The present disclosure further relates to a method of manufacturing flip-chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized.