申请人:SIKA TECHNOLOGY AG
公开号:US20190300697A1
公开(公告)日:2019-10-03
A curable epoxy resin composition including at least one epoxy resin, at least one inorganic filler and at least one dispersant, wherein the dispersant includes: (a) at least one first polymer, which is a comb polymer having a polymer backbone including acid groups and side chains which are linked to the polymer backbone, and (b) at least one second polymer, which is a condensate of, at least, an aromatic compound and formaldehyde; or a lignosulfonate.