RESIST OVERLAYER FILM FORMING COMPOSITION FOR LITHOGRAPHY AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
申请人:NISSAN CHEMICAL INDUSTRIES, LTD.
公开号:US20150248057A1
公开(公告)日:2015-09-03
A resist overlayer film forming composition that is used for a lithography process for manufacturing semiconductor devices, and selectively transmits EUV only, in particular, by blocking exposure light undesirable for EUV exposure, such as UV and DUV, without intermixing with a resist, and that can be developed with a developing solution after exposure. A resist overlayer film forming composition including: a hydroxyl group-containing novolac-based polymer containing a structure of (Formula 1-1):
(in (Formula 1-1), Ar
1
is a divalent organic group that contains 1 to 3 benzene ring(s) and optionally contains a hydroxy group; Ar
2
is a benzene ring group, a naphthalene ring group, or an anthracene ring group; each of the hydroxy group and R
1
is a substituent for a hydrogen atom on a ring of Ar
2
); and a solvent.