4-(4,4-Diaminocyclohexa-2,5-dien-1-ylidene)-5,5-bis(trifluoromethoxy)cyclohex-2-ene-1,1-diamine

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 4-(4,4-Diaminocyclohexa-2,5-dien-1-ylidene)-5,5-bis(trifluoromethoxy)cyclohex-2-ene-1,1-diamine
• 英文别名: 4-(4,4-diaminocyclohexa-2,5-dien-1-ylidene)-5,5-bis(trifluoromethoxy)cyclohex-2-ene-1,1-diamine
• 化学式: C₁₄H₁₆F₆N₄O₂
• 分子量: 386.29
• InChiKey: WKSCBJUSAMAMNU-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0
• 重原子数：
  26
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.43
• 拓扑面积：
  123
• 氢给体数：
  4
• 氢受体数：
  12

文献信息

• Aromatic polyamide films for transparent flexible substrates
  申请人：Akron Polymers Systems, Inc.

  公开号：US11046825B2

  公开（公告）日：2021-06-29

  The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300 C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.

  本发明的目的是用玻璃化转变温度高于 300 C 的可溶性芳香族共聚多酰胺制备透明薄膜。这种共聚多酰胺含有悬垂羧基，使用 N,N-二甲基乙酰胺（DMAc）、N-甲基-2-吡咯烷酮（NMP）或其它极性溶剂将其溶液浇铸成薄膜。薄膜在共聚物玻璃转化温度附近进行热固化。固化后，聚合物薄膜在 400 纳米到 750 纳米之间的透光率大于 80%，热膨胀系数小于 20 ppm，并且具有耐溶剂性。这些薄膜可用作微电子设备的柔性基底。
• [EN] AROMATIC POLYAMIDE FILMS FOR SOLVENT RESISTANT FLEXIBLE SUBSTRATES<br/>[FR] FILMS À BASE D'UN POLYAMIDE AROMATIQUE POUR SUBSTRATS FLEXIBLES RÉSISTANT AUX SOLVANTS
  申请人：AKRON POLYMER SYSTEMS INC

  公开号：WO2014105890A1

  公开（公告）日：2014-07-03

  This disclosure, viewed from one aspect, relates to a solution of polyamide comprising: an aromatic polyamide, silane coupling agent and a solvent. The solution of polyamide can improve adhesion between the polyamide film and the base of glass or silicon wafer.