MONOMER, POLYMER, RESIST COMPOSITION, AND PATTERNING PROCESS
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US20150322027A1
公开(公告)日:2015-11-12
A monomer (1) is prepared by reacting a compound (9) with a base or metal to form a metal enolate reagent, and reacting the metal enolate reagent with an acyloxyketone compound (8). A polymer derived from the monomer is used as base resin to formulate a resist composition, which is shelf stable and displays a high dissolution contrast, controlled acid diffusion and low roughness in forming positive pattern via alkaline development and in forming negative pattern via organic solvent development.
METHOD FOR MANUFACTRURING BETA-(METH)ACRYLOYLOXY-GAMMA-BUTYROLACTONES
申请人:JNC CORPORATION
公开号:US20150126753A1
公开(公告)日:2015-05-07
The art relates to provision of a method for manufacturing an (meth)acrylic polymerizable monomer that can be used in various applications, such as an optical material, a resist material, a coating material and a laminate material, and provision of a new β-(meth)acryloyloxy-γ-butyrolactone compound by applying the manufacturing method. The method for manufacturing the β-(meth)acryloyloxy-γ-butyrolactone compound is described, in which a (meth)acrylate compound having a carbonyl group and a ketene compound are condensed and isomerized. Further, the manufacturing method is applied to the new β-(meth)acryloyloxy-γ-butyrolactone compound.
MONOMER, POLYMER, POSITIVE RESIST COMPOSITION, AND PATTERNING PROCESS
申请人:Shin-Etsu Chemical Co., Ltd.
公开号:US20170008982A1
公开(公告)日:2017-01-12
A polymer comprising recurring units derived from a polymerizable monomer having two structures of hydroxyphenyl methacrylate having a hydroxy group substituted with an acid labile group is used as base resin in a positive resist composition, especially chemically amplified positive resist composition. The resist composition forms a resist film which is processed by lithography into a pattern of good profile having a high resolution, minimal edge roughness, and etch resistance.
A negative pattern is formed by applying a resist composition onto a substrate, exposing the resist film, and developing the exposed resist film in an organic solvent developer. The process further involves coating the negative pattern with a shrink agent solution of a polymer comprising recurring units capable of forming lactone under the action of acid in a C
7
-C
16
ester or C
8
-C
16
ketone solvent, baking the coating, and removing the excessive shrink agent via organic solvent development for thereby shrinking the size of spaces in the pattern.