THERMOPLASTIC LIQUID CRYSTAL POLYMER FILM, AND LAMINATE AND CIRCUIT BOARD USING SAME
申请人:KURARAY CO., LTD.
公开号:US20140231123A1
公开(公告)日:2014-08-21
To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (∈
r2
) of the film after heating to a dielectric constant (∈
r1
) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30° C. lower than a melting point of the film to a temperature being 10° C. higher than the melting point,
|∈
r2
−∈
r1
|/∈
r1
×100≦5 (I)
where ∈
r1
denotes the relative dielectric constant before the heating, ∈
r2
denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 GHz.