Dodecyl-dimethyl-phenacylazanium

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: Dodecyl-dimethyl-phenacylazanium
• 化学式: C22H38NO+
• 分子量: 332.5
• InChiKey: WZYFNJQHCZKMIL-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  7.3
• 重原子数：
  24
• 可旋转键数：
  14
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.68
• 拓扑面积：
  17.1
• 氢给体数：
  0
• 氢受体数：
  1

文献信息

• THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：EP3162868A1

  公开（公告）日：2017-05-03

  Provided are a thermal base generator which is capable of performing cyclization of a thermosetting resin at a low temperature and with which a thermosetting resin composition having excellent stability can be prepared, a thermosetting resin composition, a cured film, a cured film manufacturing method, and a semiconductor device. The thermal base generator includes at least one selected from an acidic compound which generates a base in a case of being heated to 40°C or higher, and an ammonium salt containing an anion having a pKa1 of 0 to 4 and an ammonium cation. The acidic compound is preferably an ammonium salt and/or a compound represented by the following General Formula (1), in which A1 represents a p-valent organic group, R1 represents a monovalent organic group, L1 represents an (m+1)-valent organic group, m represents an integer of 1 or more, and p represents an integer of 1 or more.

  本发明提供了一种热碱发生器，它能够在低温下对热固性树脂进行环化，并用它制备出稳定性极佳的热固性树脂组合物、热固性树脂组合物、固化膜、固化膜制造方法和半导体设备。 热碱发生器包括至少一种酸性化合物和铵盐，前者在加热到 40°C 或更高温度时产生碱，后者含有 pKa1 为 0 至 4 的阴离子和铵阳离子。酸性化合物最好是铵盐和/或下式（1）所代表的化合物，其中 A1 代表 p 价有机基团，R1 代表一价有机基团，L1 代表 (m+1)- 价有机基团，m 代表 1 或 1 以上的整数，p 代表 1 或 1 以上的整数。
• POLYIMIDE PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, A SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING POLYIMIDE PRECURSOR COMPOSITION
  申请人：FUJIFILM Corporation

  公开号：US20180079864A1

  公开（公告）日：2018-03-22

  Provided are a photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition. A polyimide precursor composition in which the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole; in General Formula (1-2), A 1 and A 2 each independently represent an oxygen atom or NH, R 111 and R 112 each independently represent a single bond or a divalent organic group, and R 113 and R 114 each independently represent a hydrogen atom or a monovalent organic group.
• PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：US20180118887A1

  公开（公告）日：2018-05-03

  Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.
• RESIN, COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：US20180215874A1

  公开（公告）日：2018-08-02

  Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.
• [EN] NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, CURED FILM PRODUCTION METHOD AND SEMICONDUCTOR DEVICE<br/>[FR] COMPOSITION DE RÉSINE PHOTOSENSIBLE NÉGATIVE, FILM DURCI, PROCÉDÉ DE PRODUCTION DE FILM DURCI, ET DISPOSITIF À SEMI-CONDUCTEUR<br/>[JA] ネガ型感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス
  申请人：FUJIFILM CORP

  公开号：WO2017002859A1

  公开（公告）日：2017-01-05

  露光ラチチュードが広いネガ型感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイスの提供。ポリイミド前駆体；ラジカル重合開始剤；芳香族性水酸基を有する化合物から選択される少なくとも１種の第１の重合禁止剤；並びに、ニトロソ化合物、Ｎ－オキシド化合物、キノン化合物、Ｎ－オキシル化合物およびフェノチアジン化合物から選択される少なくとも１種の第２の重合禁止剤を含む、ネガ型感光性樹脂組成物。