2-(4-acetylphenyl)-3a,4,7,7a-tetrahydro-1H-4,7-methanoisoindole-1,3(2H)-dione

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 2-(4-acetylphenyl)-3a,4,7,7a-tetrahydro-1H-4,7-methanoisoindole-1,3(2H)-dione
• 英文别名: 4-(4-acetylphenyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione
• 化学式: C₁₇H₁₅NO₃
• 分子量: 281.3
• InChiKey: JWVDAFTVVWQDQC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.5
• 重原子数：
  21
• 可旋转键数：
  2
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.35
• 拓扑面积：
  54.4
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME
  申请人：JUNG Myung Sup

  公开号：US20100124037A1

  公开（公告）日：2010-05-20

  A thermosetting composition including an organic solvent, a liquid crystalline thermoset oligomer, and either a crosslinking agent or an epoxy resin or both is disclosed. A printed circuit board which includes the thermosetting composition is also disclosed. The printed circuit board is produced by impregnating the thermosetting composition into a reinforcing material.

  本发明公开了一种热固性组合物，包括有机溶剂、液晶热固性低聚物，以及交联剂或环氧树脂或两者都有。本发明还公开了一种包括该热固性组合物的印刷电路板。该印刷电路板是通过将该热固性组合物浸渍到增强材料中制造的。
• Photosensitive Novolac Resin, Positive Photosensitive Resin Composition Including Same, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film
  申请人：LEE Jong-Hwa

  公开号：US20130171563A1

  公开（公告）日：2013-07-04

  Disclosed is a photosensitive novolac resin including a structural unit represented by the following Chemical Formula 1 and structural unit represented by the following Chemical Formula 2, wherein R 11 , R 12 , R 13 , and R 14 in Chemical Formulae 1 and 2 are the same as defined in the detailed description, a positive photosensitive resin composition including the same, a photosensitive resin film fabricated using the same, and a semiconductor device including the photosensitive resin composition.

  本发明公开了一种光敏性新乐酸树脂，其中包括由以下化学式1表示的结构单元和由以下化学式2表示的结构单元，其中化学式1和2中的R11，R12，R13和R14与详细描述中定义的相同，以及包括该树脂的正向光敏树脂组合物，使用该组合物制造的光敏树脂膜，以及包括该光敏树脂组合物的半导体器件。
• Novel Phenol Compounds and Positive Photosensitive Resin Composition Including the Same
  申请人：JEONG Ji-Young

  公开号：US20120156614A1

  公开（公告）日：2012-06-21

  Disclosed are a novel phenol compound comprising a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, or a combination thereof, and a positive photosensitive resin composition including the same.
• US8765012B2
  申请人：——

  公开号：US8765012B2

  公开（公告）日：2014-07-01
• US8785103B2
  申请人：——

  公开号：US8785103B2

  公开（公告）日：2014-07-22