N,N'-diphenylguanidine monohydrobromide | 93982-96-8

• 物质功能分类: 化学试剂 - 有机试剂 - 胍盐
• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: N,N'-diphenylguanidine monohydrobromide
• 英文别名: N,N-Diphenylguanidine MonoHBr；1,2-diphenylguanidine;hydron;bromide
• CAS: 93982-96-8
• 化学式: BrH*C₁₃H₁₃N₃
• 分子量: 292.178
• InChiKey: DSESGJJGBBAHNW-UHFFFAOYSA-N

物化性质

• 熔点：
  158-160 °C
• 稳定性/保质期：

  在常温常压下稳定，应避免与水分和强氧化剂接触。

计算性质

• 辛醇/水分配系数(LogP)：
  3.32
• 重原子数：
  17
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  50.4
• 氢给体数：
  3
• 氢受体数：
  1

安全信息

• 海关编码：
  2925290090
• 危险性防范说明：
  P280,P305+P351+P338
• 危险性描述：
  H317,H319

制备方法与用途

用途：用于合成橡胶添加剂和助焊剂。

反应信息

• 作为反应物：
  描述：

  氢溴酸 、 indium(III) bromide 、 N,N'-diphenylguanidine monohydrobromide 以 水 为溶剂， 生成 (DPG)₃InBr₆
  参考文献：
  名称：

  设计具有高效本征宽带发射的基于胍的无铅杂化铟钙钛矿

  摘要：

  发光材料的最新进展凸显了零维（0D）杂化金属卤化物作为高效候选材料。值得注意的是，In 3+基有机-无机金属卤化物（OIMH）越来越被认为是有前途的固态发光材料。然而，这些材料相对较低的光产额极大地限制了它们在先进光电器件中的应用。在这项研究中，我们设计了一种新型的0D杂化卤化铟，(C 13 H 14 N 3 ) 3 InBr 6，其中C 13 H 14 N 3代表1,3-二苯胍。该化合物的结构是，卤素阴离子多面体被大的胍阳离子完全隔离，并在这些阳离子上以相当大的距离规则排列，从而形成近乎理想的主客体结构。令人印象深刻的是，0D卤化铟表现出本征宽带黄橙色光发射，实现了86.12%的光致发光量子产率（PLQY），这是迄今为止报道的In基OIMHs的最高PLQY。此外，我们成功地使用(C 13 H 14 N 3 ) 3 InBr 6作为黄色荧光粉制造了白光发光二极管(WLED) ，从而展示了新型胍基卤化铟在固态照明应用中的潜力。

  DOI：

  10.1039/d4tc00482e
• 作为产物：
  描述：

  溴化氰 、 苯胺 以 乙醇 为溶剂， 反应 1.5h， 以97%的产率得到N,N'-diphenylguanidine monohydrobromide
  参考文献：
  名称：

  Design, Synthesis, and Pharmacological Evaluation of Conformationally Constrained Analogues of N,N‘-Diaryl- and N-Aryl-N-aralkylguanidines as Potent Inhibitors of Neuronal Na⁺ Channels

  摘要：

  In the present investigation, the rationale for the design, synthesis, and biological evaluation of potent inhibitors of neuronal Nai channels is described. N,N'-Diaryl- and N-aryl-N-aralkylguanidine templates were locked in conformations mimicking the permissible conformations of the flexible diarylguanidinium ion (AS(+), AA(+), SS+). The resulting set of constrained guanidines termed "lockamers" (cyclophane, quinazoline, aminopyrimidazolines, aminoimidazolines azocino- and tetrahydroquinolinocarboximidamides) was examined for neuronal Na+ channel blockade properties. Inhibition of [C-14]guanidinium ion influx in CHO cells expressing type IIA Na+ channels showed that the aminopyrimidazoline 9b and aminoimidazoline 9d, compounds proposed to lock the N,N'-diarylguanidinium in an SS+ conformation, were the most potent Na+ channel blockers with IC50's of 0.06 mu M, a value 17 times lower than that of the parent flexible compound 18d. The rest of the restricted analogues with 4-p-alkyl substituents retained potency with IC50 values ranging between 0.46 and 2.9 mu M. Evaluation in a synaptosomal Ca-45(2+) influx assay showed that 9b did not exhibit high selectivity for neuronal Na+ vs Ca2+ channels. The retention of significant neuronal Na+ blockade in all types of semirigid conformers gives evidence for a multiple mode of binding in this class of compounds and can possibly be attributed to a poor structural specificity of the site(s) of action. Compound 9b was also found to be the most active compound in vivo based on the high level of inhibition of seizures exhibited in the DBA/2 mouse model. The pK(a) value of 9b indicates that 9b binds to the channel in its protonated form, and log D vs pH measurements suggest that ion-pair partitioning contributes to membrane transport. This compound stands out as an interesting lead for further development of neurotherapeutic agents.

  DOI：

  10.1021/jm980124a

文献信息

• SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTRONIC DEVICE COMPRISING THE SAME
  申请人：Duksan Hi-Metal Co., Ltd.

  公开号：EP2412775A2

  公开（公告）日：2012-02-01

  The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 300°C, a first binder including a rosin compound, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same.

  本发明涉及一种焊料粘合剂及其生产方法，以及包含该焊料粘合剂的电子设备，更具体地说，本发明涉及一种焊料粘合剂，该焊料粘合剂包含一种熔点为 130 至 300°C 的含锡合金、一种包含松香化合物的第一粘合剂和一种包含热固性树脂的第二粘合剂，以及包含该焊料粘合剂的生产方法和包含该焊料粘合剂的电子设备。
• FLUX AND SOLDER PASTE
  申请人：Senju Metal Industry Co., Ltd.

  公开号：EP4063060A1

  公开（公告）日：2022-09-28

  Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.

  本文提供了可改善焊料润湿性的助焊剂，以及使用该助焊剂的焊膏。该助焊剂含有 0.5-20.0 wt%的（2-羧基烷基）异氰尿酸酯加合物和 5.0-45.0 wt%的松香，还含有一种溶剂。(2-羧基烷基)异氰尿酸酯加合物是单(2-羧基烷基)异氰尿酸酯加合物、双(2-羧基烷基)异氰尿酸酯加合物、三(2-羧基烷基)异氰尿酸酯加合物或其中两种或两种以上的组合。
• Flux and resin composition for flux
  申请人：SENJU METAL INDUSTRY CO., LTD.

  公开号：US10556299B2

  公开（公告）日：2020-02-11

  An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

  本发明的目的是提供一种在焊接时可抑制桥和球发生的助焊剂，以及一种用于该助焊剂的树脂组合物。 该助焊剂包括：至少一种选自 0.3 至 2.0 质量％的有机氯化合物，以及大于 0.04 质量％和 1.00 质量％或更少的胺盐酸盐；和 0.2 至 1.5 质量％的有机磷化合物，至少选自膦酸酯和苯基取代膦酸中的一种，每种都以整个助熔剂为基础。
• Flux and solder paste
  申请人：SENJU METAL INDUSTRY CO., LTD.

  公开号：US10987764B2

  公开（公告）日：2021-04-27

  It is an object of the present invention to provide a flux containing flux components homogeneously dispersed without precipitation of aggregates in addition to having an appropriate balance between fluidity and shape retention property, and a solder paste. A flux comprising 0.5 to 3.5 mass % of a sorbitol-type thixotropic agent selected from the group consisting of dibenzylidene sorbitol, bis(4-methylbenzylidene)sorbitol and a combination thereof, and 2 to 350 mass ppm of a sorbitol-type additive selected from the group consisting of sorbitol, monobenzylidene sorbitol, mono(4-methylbenzylidene)sorbitol and a combination thereof, and a glycol ether-type solvent.

  本发明的目的是提供一种助焊剂，其中的助焊剂成分不仅在流动性和形状保持性能之间取得适当平衡，而且分散均匀，不会析出团聚体。助焊剂包含 0.5 至 3.5 质量％的山梨醇型触变剂，该触变剂选自二亚苄基山梨醇、双(4-甲基亚苄基)山梨醇及其组合，以及 2 至 350 质量 ppm 的山梨醇型添加剂，该添加剂选自山梨醇、单亚苄基山梨醇、单(4-甲基亚苄基)山梨醇及其组合，以及乙二醇醚类溶剂。
• FLUX AND RESIN COMPOSITION FOR FLUX
  申请人：Senju Metal Industry Co., Ltd.

  公开号：EP3698913B1

  公开（公告）日：2022-01-19