1,3-Bis-<5-amino-benzthiazolyl-(2)>-benzol | 17201-30-8

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 1,3-Bis-<5-amino-benzthiazolyl-(2)>-benzol
• 英文别名: 2,2'-m-phenylene-bis-benzooxazol-5-ylamine；2-[3-(5-Amino-1,3-benzoxazol-2-yl)phenyl]-1,3-benzoxazol-5-amine
• CAS: 17201-30-8
• 化学式: C₂₀H₁₄N₄O₂
• 分子量: 342.357
• InChiKey: FJQLMAYWPRQCCP-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.6
• 重原子数：
  26
• 可旋转键数：
  2
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  104
• 氢给体数：
  2
• 氢受体数：
  6

反应信息

• 作为产物：
  描述：

  间苯二甲酸 、 2,4-diaminophenol dihydrochloride 在 PPA 作用下， 生成 1,3-Bis-<5-amino-benzthiazolyl-(2)>-benzol
  参考文献：
  名称：

  Preston,J. et al., Journal of Heterocyclic Chemistry, 1968, vol. 5, p. 269 - 273

  摘要：

  DOI：

文献信息

• POLYAMIDE ACID AND RESIN COMPOSITION CONTAINING SAME
  申请人：Toray Industries, Inc.

  公开号：EP2832769A1

  公开（公告）日：2015-02-04

  The invention aims to provide polyamic acid that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics and further aims to produce cured coat film with good mechanical characteristics regardless of whether the molar concentration of the acid anhydride group in the acid dianhydride monomer and that of the amino group in the multivalent amine compound or diamine compound are identical to or different from each other. This objective is met by polyamic acid including a structure as represented by chemical formula (1) given below: (In chemical formula (1), δ represents an oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

  本发明旨在提供可形成低粘度清漆的聚酰胺酸，通过固化可生产出具有良好机械特性的 涂膜，并进一步旨在生产出具有良好机械特性的固化涂膜，无论酸酐单体中酸酐基团的摩尔 浓度与多价胺化合物或二胺化合物中氨基的摩尔浓度是相同还是不同。包括如下化学式（1）所示结构的聚酰胺可以达到这一目的：(在化学式（1）中，δ 代表氧原子或硫原子，W 代表抽电子基团，R11 和 R12 分别独立地代表氢原子或具有 1 至 10 个碳原子的烃基。
• POLYAMIDE ACID RESIN COMPOSITION, POLYIMIDE FILM USING SAME, AND METHOD FOR PRODUCING SAID POLYIMIDE FILM
  申请人：Toray Industries, Inc.

  公开号：EP2881417A1

  公开（公告）日：2015-06-10

  An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), δ represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.

  一个目的是提供一种聚酰胺酸树脂组合物，它能形成一种低粘度清漆，并能通过 固化产生具有良好机械特性的涂膜。另一个目的是提供一种聚氨基甲酸酯树脂组合物，其中的酸酐端基与二胺的反应活性较低，并能产生一种二胺不会明显析出的清漆。含有以下成分的聚酰胺树脂组合物可以达到上述目的：(a) 聚酰胺和 (b) 化学式（1）所表示的化合物。(在化学式（1）中，Z 是含有 2 个或 2 个以上碳原子的二价或高价有机基团，V 是化学式（2）所代表的结构，k 是 2 个或 2 个以上的整数）。(在化学式（2）中，δ代表氧原子或硫原子，W代表抽电子基团，R11 和 R12 独立地代表氢原子或含有 1 至 10 个碳原子的烃基。
• CURED FILM AND METHOD FOR MANUFACTURING SAME
  申请人：Toray Industries, Inc.

  公开号：EP3358407A1

  公开（公告）日：2018-08-08

  Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

  本发明提供了一种对金属铜具有高延伸率、低应力和高附着力的固化薄膜。该固化膜是通过固化感光树脂组合物形成的，其中感光树脂包括聚羟酰胺，固化膜中聚羟酰胺的环闭率不超过 10%。
• Cured film formed by curing photosensitive resin composition and method for manufacturing same
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10545406B2

  公开（公告）日：2020-01-28

  Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.

  本发明提供了一种对金属铜具有高延伸率、低应力和高附着力的固化薄膜。该固化膜是通过固化感光树脂组合物形成的，其中感光树脂包括聚羟酰胺，固化膜中聚羟酰胺的环闭率不超过 10%。
• Resin composition for display substrate, and heat-resistant resin film, organic EL display substrate, and method for manufacturing organic EL display using same
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10590306B2

  公开（公告）日：2020-03-17

  A resin composition for a display substrate, the resin composition including a solvent and a heat-resistant resin or a precursor thereof, wherein the solvent has as a main component an amide compound having a surface tension of 35 mN/m or less at 25° C. Provided is a resin composition for a display substrate, whereby pinholing of a thin film is not prone to occur.

  一种用于显示基板的树脂组合物，该树脂组合物包括溶剂和耐热树脂或其前体，其中溶剂的主要成分是酰胺化合物，其在 25°C 时的表面张力为 35 mN/m 或更小。