申请人:——
公开号:US20030054292A1
公开(公告)日:2003-03-20
A method for forming a fine pattern in a semiconductor substrate, by coating a target layer to be etched on a semiconductor substrate with a resist composition including at least one compound capable of forming a photoresist pattern by a photolithography process, and a free radical initiator. The free radical initiator is capable of being decomposed by a thermal process at a temperature equal to or higher than the glass transition temperature of the at least one compound. A lithography process is performed on the resist compound layer to form a photoresist pattern. The resist compound layer having the photoresist pattern formed therein is heated to a temperature equal to or higher than the glass transition temperature of the at least one compound, and wherein a partial cross-linking reaction in the resist composition occurs.
一种在半导体衬底上形成精细图案的方法,在半导体衬底上的待蚀刻目标层上涂覆抗蚀剂组合物,抗蚀剂组合物包括至少一种能通过光刻工艺形成光刻胶图案的化合物和一种自由基引发剂。自由基引发剂能够在等于或高于至少一种化合物玻璃转化温度的温度下通过热处理分解。在抗蚀剂化合物层上进行光刻处理,以形成光刻胶图案。将具有光刻胶图案的抗蚀剂化合物层加热到等于或高于至少一种化合物的玻璃化温度,其中抗蚀剂成分发生部分交联反应。