2,2,6,6-tetramethylheptane-3,5-dione;zinc

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 2,2,6,6-tetramethylheptane-3,5-dione;zinc
• 化学式: C22H40O4Zn
• 分子量: 433.9
• InChiKey: FGRQBMHHOXESRC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.21
• 重原子数：
  27
• 可旋转键数：
  4
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.82
• 拓扑面积：
  68.3
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• Curable resin composition, cured product thereof, and semiconductor device
  申请人：DAICEL CORPORATION

  公开号：US10619046B2

  公开（公告）日：2020-04-14

  An object of the present invention is to provide a curable resin composition for forming a less tacky cured product having excellent gas barrier properties, heat resistance, light resistance, flexibility and heat shock resistance. The curable resin composition comprises the following components (A), (B), (C), and (D), wherein a content of the component (C) is 0.3 to 20 wt %, based on the total amount of the composition: (A): a polyorganosiloxane represented by an average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4, wherein each R1 is alkyl, aryl, alkenyl, etc., and a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol %, based on the total amount of R1, and a1>0, a2>0, a3≥0, a4>0, 0.5≤a1/a2≤10, and a1+a2+a3+a4=1; (B): a polyorganosiloxane represented by an average composition formula: R2mHnSiO[(4-m-n)/2] wherein R2 is alkyl or aryl, and 0.7≤m≤2.1, 0.001≤n≤1.0, and 0.8≤m+n≤3; (C): a straight-chain polyorganosiloxane represented by a general formula (III-1): wherein R3 is alkyl, and y is an integer of not less than 1 and not more than 100; and (D): a hydrosilylation catalyst.

  本发明的目的是提供一种可固化树脂组合物，用于形成具有优异气体阻隔性、耐热性、耐光性、柔韧性和耐热震性的低粘性固化产品。该可固化树脂组合物包括以下组分（A）、（B）、（C）和（D），其中组分（C）的含量为组合物总量的 0.3 至 20 wt %： (A): 由平均单元式表示的聚有机硅氧烷：(SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4，其中每个 R1 是烷基、芳基、烯基等、以 R1 的总量为基准，烷基的百分比为 50 至 98 摩尔％，芳基的百分比为 1 至 50 摩尔％，烯基的百分比为 1 至 35 摩尔％，a1＞0，a2＞0，a3≥0，a4＞0，0.5≤a1/a2≤10，a1+a2+a3+a4=1； (B) 一种聚有机硅氧烷，其平均组成式为R2mHnSiO[(4-m-n)/2]，其中 R2 为烷基或芳基，0.7≤m≤2.1，0.001≤n≤1.0，0.8≤m+n≤3； (C) 由通式(III-1)代表的直链聚有机硅氧烷： 其中 R3 是烷基，y 是不小于 1 也不大于 100 的整数；以及 (D): 氢硅烷化催化剂。
• CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE
  申请人：DAICEL CORPORATION

  公开号：US20190106571A1

  公开（公告）日：2019-04-11

  An object of the present invention is to provide a curable resin composition for forming a less tacky cured product having excellent gas barrier properties, heat resistance, light resistance, flexibility and heat shock resistance. The curable resin composition comprises the following components (A), (B), (C), and (D), wherein a content of the component (C) is 0.3 to 20 wt %, based on the total amount of the composition: (A): a polyorganosiloxane represented by an average unit formula: (SiO 4/2 ) a1 (R 1 SiO 3/2 ) a2 (R 1 2 SiO 2/2 ) a3 (R 1 3 SiO 1/2 ) a4 , wherein each R 1 is alkyl, aryl, alkenyl, etc., and a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol %, based on the total amount of R 1 , and a1>0, a2>0, a3≥0, a4>0, 0.5≤a1/a2≤10, and a1+a2+a3+a4=1; (B): a polyorganosiloxane represented by the following average composition formula (II): R 2 m H n SiO [(4-m-n)/2] wherein R 2 is alkyl or aryl, and 0.7≤m≤2.1, 0.001≤n≤1.0, and 0.8≤m+n≤3; (C): a straight-chain polyorganosiloxane represented by a general formula (III-1): wherein R 3 is alkyl, and y is an integer of not less than 1 and not more than 100; and (D): a hydrosilylation catalyst.