2-[2-[2-[2-[2-[2-[2-[2-[2-(2-Octadec-9-enoxyethoxy)ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethanol | 24871-34-9

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 2-[2-[2-[2-[2-[2-[2-[2-[2-(2-Octadec-9-enoxyethoxy)ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethanol
• CAS: 24871-34-9
• 化学式: C₃₈H₇₆O₁₁
• 分子量: 709.0
• InChiKey: QYOVMAREBTZLBT-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6
• 重原子数：
  49
• 可旋转键数：
  45
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.95
• 拓扑面积：
  113
• 氢给体数：
  1
• 氢受体数：
  11

文献信息

• Print pastes for reactive printing
  申请人：Cognis Deutschland GmbH & Co. KG

  公开号：EP1249477A1

  公开（公告）日：2002-10-16

  Pasty preparation for reactive printing, containing at least A) a thickener based on polysaccharides B) an additive selected from the group consisting of B1) the saturated and/or unsaturated ethoxylated fatty alcohols, fatty amines and fatty acids having a degree of alkoxylation of 6 to 20 and/or the group consisting of B2) alkyl(oligo)glycosides of the formula R-O[G]p where R is a saturated or unsaturated alkyl radical of 1 to 6 carbon atoms, G is a glycoside radical and p is from 1 to 10, C) a reactive dye and D) an alkaline colour fixative.

  用于活性印刷的糊状制剂，至少含有 A) 基于多糖的增稠剂 B) 选自以下组别的添加剂 B1) 烷氧基化程度为 6 至 20 的饱和和/或不饱和乙氧基化脂肪醇、脂肪胺和脂肪酸 和/或由以下物质组成的组 B2) 式 R-O[G]p 的烷基（低聚）糖苷，其中 R 为 1 至 6 个碳原子的饱和或不饱和烷基，G 为糖苷基，p 为 1 至 10、 C) 活性染料和 D) 一种碱性固色剂。
• Slurry composition for chemical mechanical polishing
  申请人：SAMSUNG ELECTRONICS CO., LTD.

  公开号：US10428242B2

  公开（公告）日：2019-10-01

  A slurry composition for chemical mechanical polishing, the slurry composition including ceramic polishing particles; a dispersion agent; a pH control agent and an additive having affinity with silicon nitride.

  一种用于化学机械抛光的浆料组合物，浆料组合物包括抛光陶瓷颗粒、分散剂、pH 值控制剂和与氮化硅有亲和力的添加剂。
• Viscosifier for enhanced oil recovery
  申请人：Halliburton Energy Services, Inc.

  公开号：US10544354B2

  公开（公告）日：2020-01-28

  Various embodiments disclosed relate to methods, compositions, and systems for enhanced oil recovery including a viscosifier polymer. In various embodiments, the present invention provides a method of enhanced oil recovery that can include obtaining or providing a composition that includes a viscosifier polymer. The viscosifier polymer includes an ethylene repeating unit including a —C(O)NH2 group and an ethylene repeating unit including an —S(O)2OR1 group, where the repeating units are in block, alternate, or random configuration. At each occurrence R1 can be independently selected from the group consisting of —H and a counterion. The method can include placing the composition in a subterranean formation downhole via an injection wellbore. The method can also include extracting material comprising petroleum from the subterranean formation downhole via a production wellbore.

  本发明公开的各种实施方案涉及包括增粘聚合物的提高石油采收率的方法、组合物和系统。在各种实施方案中，本发明提供了一种提高石油采收率的方法，该方法可包括获得或提供一种包括增粘聚合物的组合物。粘聚剂聚合物包括包括-C(O)NH2基团的乙烯重复单元和包括-S(O)2OR1基团的乙烯重复单元，其中重复单元为嵌段、交替或无规构型。在每次出现时，R1 可独立选自-H 和反离子组成的组。该方法可包括通过注入井筒将组合物置于井下的地下地层中。该方法还可包括通过生产井筒从井下的地下岩层中提取包含石油的材料。
• Slurry composition for chemical mechanical polishing, method of preparing the same, and method of fabricating semiconductor device by using the same
  申请人：Samsung Electronics Co., Ltd.

  公开号：US10829690B2

  公开（公告）日：2020-11-10

  Disclosed is a slurry composition for chemical mechanical polishing (CMP) includes, as polishing particles, a complex compound of both fullerenol and alkylammonium hydroxide. The slurry composition, which exhibits excellent polishing properties, may be prepared at low cost in large quantities. Also disclosed is a method of preparing the slurry composition comprising obtaining a mixture of a fullerenol complex compound and unreacted hydrogen peroxide by reacting alkylammonium hydroxide, hydrogen peroxide, and fullerene, removing the unreacted hydrogen peroxide by adding hydrogen peroxide decomposition catalyst particles to the mixture, separating the hydrogen peroxide decomposition catalyst particles from the mixture by filtration, and adding a polishing additive to the mixture. Further disclosed is a method of fabricating a semiconductor device that includes providing a pattern defining a trench, forming a metal material film on the pattern to fill the trench, and performing CMP of the metal material film using the slurry composition.

  公开了一种用于化学机械抛光（CMP）的浆料组合物，其中包括富勒烯醇和氢氧化烷基铵的复合物作为抛光颗粒。这种浆料组合物具有优异的抛光性能，可以低成本大量制备。还公开了一种制备该浆料组合物的方法，包括通过使氢氧化烷基铵、过氧化氢和富勒烯反应获得富勒烯醇复合物和未反应的过氧化氢的混合物，通过向混合物中加入过氧化氢分解催化剂颗粒去除未反应的过氧化氢，通过过滤将过氧化氢分解催化剂颗粒从混合物中分离出来，以及向混合物中加入抛光添加剂。进一步公开了一种制造半导体器件的方法，该方法包括提供限定沟槽的图案，在图案上形成金属材料膜以填充沟槽，以及使用浆料组合物对金属材料膜进行 CMP。
• Slurry composition and method of manufacturing integrated circuit device by using the same
  申请人：SAMSUNG ELECTRONICS CO., LTD.

  公开号：US11186749B2

  公开（公告）日：2021-11-30

  A slurry composition is disclosed which includes: a corrosion inhibitor including a material selected from carbon allotropes and derivatives thereof; and an oxidant. A method of manufacturing an integrated circuit device is disclosed which includes: forming a first metal film and a second metal film on a substrate, the first metal film and the second metal film respectively including different metals; and polishing, by using the slurry composition, a polishing target surface at which the first metal film and the second metal film are exposed.

  本发明公开了一种浆料组合物，其中包括：一种腐蚀抑制剂，包括一种选自碳同素异形体及其衍生物的材料；以及一种氧化剂。本发明公开了一种制造集成电路器件的方法，包括：在基板上形成第一金属膜和第二金属膜，第一金属膜和第二金属膜分别包括不同的金属；以及通过使用浆料组合物抛光第一金属膜和第二金属膜暴露的抛光目标表面。