(6Z)-6-[(hydroxyamino)methylidene]cyclohexa-2,4-dien-1-one

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: (6Z)-6-[(hydroxyamino)methylidene]cyclohexa-2,4-dien-1-one
• 化学式: C₇H₇NO₂
• 分子量: 137.14
• InChiKey: GFCNBJDXQMZOOC-WAYWQWQTSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.4
• 重原子数：
  10
• 可旋转键数：
  1
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  49.3
• 氢给体数：
  2
• 氢受体数：
  3

文献信息

• [EN] PYRAZOLO[4,3-B]PYRIDINE-7-AMINE INHIBITORS OF ALK5<br/>[FR] INHIBITEURS D'ALK 5 À BASE DE PYRAZOLO[4,3-B]PYRIDINE-7-AMINE
  申请人：TAKEDA PHARMACEUTICAL

  公开号：WO2011146287A1

  公开（公告）日：2011-11-24

  The present invention provides ALK5 inhibitors of the formula (I) wherein the variables are as defined herein. Also provided are pharmaceutical compositions, methods of making the compounds and intermediates thereof; and methods of using the compounds.

  本发明提供了式(I)的ALK5抑制剂，其中变量如本文所定义。还提供了药物组合物、制备化合物及其中间体的方法；以及使用这些化合物的方法。
• Compositions of a cyclooxygenase-2 selective inhibitor and a potassium ion channel modulator for the treatment of central nervous system damage
  申请人：Stephenson T. Diane

  公开号：US20050009733A1

  公开（公告）日：2005-01-13

  The present invention provides compositions and methods for the treatment of central nervous system damage in a subject. More particularly, the invention provides a combination therapy for the treatment of a central nervous system ischemic condition or a central nervous system traumatic injury comprising the administration to a subject of a potassium ion channel modulator in combination with a cyclooxygenase-2 selective inhibitor.

  本发明提供了治疗受试者中枢神经系统损伤的组合物和方法。更具体地说，本发明提供了一种用于治疗中枢神经系统缺血性疾病或中枢神经系统创伤性损伤的组合疗法，包括向受试者施用钾离子通道调节剂与环氧合酶-2 选择性抑制剂。
• POLYMÈRE À EMPREINTE ET PROCÉDÉ DE PRÉPARATION
  申请人：Université de Toulon

  公开号：EP2935376A1

  公开（公告）日：2015-10-28
• CMP SYSTEM UTILIZING HALOGEN ADDUCT
  申请人：Grumbine Steven

  公开号：US20080057715A1

  公开（公告）日：2008-03-06

  The invention provides a chemical-mechanical polishing system for polishing a substrate comprising (a) a polishing component selected from an abrasive, a polishing pad, or both an abrasive and a polishing pad, (b) an aqueous carrier, and (c) the halogen adduct resulting from the reaction of (1) an oxidizing agent selected from the group consisting of iodine, bromine, and a combination thereof, and (2) a carbon acid having a pKa of about 3 to about 14, wherein the halogen adduct is present in a concentration of about 0.01 mM or more in the aqueous carrier. The invention also provides a method of polishing a substrate comprising (i) providing the aforementioned chemical-mechanical polishing system, (ii) contacting the substrate with the polishing system, and (iii) abrading at least a portion of the surface of the substrate with the polishing system to polish the substrate,
• US7776230B2
  申请人：——

  公开号：US7776230B2

  公开（公告）日：2010-08-17