Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US11150556B2
公开(公告)日:2021-10-19
This is to provide a polymer of a polyimide precursor which is soluble in an aqueous alkaline solution, and capable of using a base resin of a positive type and negative type photosensitive resin composition which is capable of forming a fine pattern and obtaining high resolution. Also provided is a positive type and negative type photosensitive resin composition using such a polymer of a polyimide precursor. Further provided are a patterning process and a method of forming a cured film using the composition.
Provided is a polymer of a polyimide precursor which comprises a structural unit represented by the following general formula (1),
wherein, X1, R1, Z, a repeating number “s”, Y1, Rf, a repeating number “n” and “k” represent the same meanings as mentioned in the specification.
本发明旨在提供一种可溶于碱性水溶液的聚酰亚胺前体聚合物,该聚合物可用于正型和负型感光树脂组合物的基底树脂,可形成精细图案并获得高分辨率。此外,还提供了使用这种聚酰亚胺前体聚合物的正型和负型感光树脂组合物。此外,还提供了使用该组合物形成固化薄膜的图案化工艺和方法。
本发明提供了一种聚酰亚胺前体聚合物,该聚合物由以下通式 (1) 所代表的结构单元组成、
其中,X1、R1、Z、重复数字 "s"、Y1、Rf、重复数字 "n "和 "k "代表的含义与说明书中提到的相同。