Compound for forming organic film, composition for forming organic film, method for forming organic film, and patterning process
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US10429739B2
公开(公告)日:2019-10-01
The present invention provides a compound for forming an organic film which has a minimum complex viscosity of 10 Pa·s or less when the complex viscosity is measured within a range of 50° C. to 300° C. This compound for forming an organic film can provide an organic film composition having high filling and planarizing properties.
本发明提供了一种用于形成有机薄膜的化合物,当在 50° C 至 300° C 范围内测量复合粘度时,该化合物的最小复合粘度为 10 Pa-s 或更低。
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作者:WERNER L. H.、 FORD N.
DOI:——
日期:——
COMPOUND FOR FORMING ORGANIC FILM, COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US20170183531A1
公开(公告)日:2017-06-29
The present invention provides a compound for forming an organic film which has a minimum complex viscosity of 10 Pa·s or less when the complex viscosity is measured within a range of 50° C. to 300° C. This compound for forming an organic film can provide an organic film composition having high filling and planarizing properties.