申请人:Kamimura Tetsuya
公开号:US20090087989A1
公开(公告)日:2009-04-02
The invention provides a polishing liquid used for chemical mechanical polishing during planarization of a semiconductor integrated circuit, having at least: a benzotriazole compound (A) represented by the following Formula (1); an acid (B); and a water-soluble polymer (C). The invention further provides a polishing method for planarizing a semiconductor integrated circuit, the polishing method includes at least essentially chemically and mechanically polishing a barrier layer of the semiconductor integrated circuit using the polishing liquid.
In Formula (1), each of R
01
to R
05
independently represents a hydrogen atom or an alkyl group, and at least one of R
01
to R
05
represents an alkyl group.