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1,3,5-tris[(4-hydroxyphenyl)methyl]benzene | 149228-33-1

中文名称
——
中文别名
——
英文名称
1,3,5-tris[(4-hydroxyphenyl)methyl]benzene
英文别名
4-[[3,5-Bis[(4-hydroxyphenyl)methyl]phenyl]methyl]phenol
1,3,5-tris[(4-hydroxyphenyl)methyl]benzene化学式
CAS
149228-33-1
化学式
C27H24O3
mdl
——
分子量
396.486
InChiKey
ZUEQUQSNOMEMJR-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    6.4
  • 重原子数:
    30
  • 可旋转键数:
    6
  • 环数:
    4.0
  • sp3杂化的碳原子比例:
    0.11
  • 拓扑面积:
    60.7
  • 氢给体数:
    3
  • 氢受体数:
    3

上下游信息

  • 上游原料
    中文名称 英文名称 CAS号 化学式 分子量

反应信息

  • 作为反应物:
    描述:
    溴化氰1,3,5-tris[(4-hydroxyphenyl)methyl]benzene三乙胺 作用下, 以 丙酮 为溶剂, 反应 2.67h, 以60%的产率得到1,3,5-tris[(4-cyanatophenyl)methyl]benzene
    参考文献:
    名称:
    具有增强的段灵活性和出色的热化学稳定性的聚氰尿酸酯网络
    摘要:
    对于完全固化时玻璃化转变温度为320°C的氰酸酯网络,其相对较低。当在210°C下固化24小时时,网络的干玻璃转变温度范围为245至285°C,而湿玻璃转变温度范围为225至240°C。玻璃化转变温度的相似性是由于具有更刚性链段的网络中较低的固化程度所致。本质上,对于完全固化时玻璃化转变温度非常高的网络,工艺条件而不是网络的刚性决定了可达到的玻璃化转变温度。由于固化程度较高的网络往往表现出较慢的长期降解,因此在这种情况下,尽管在完全固化时表现出较低的玻璃化转变温度,但具有更大片段柔性的网络仍可实现出色的性能。这些结果说明,与用于改善高温热固性聚合物网络性能的流行试探法相反,在完全固化时具有较低玻璃化转变温度的更灵活的网络可以提供热机械性能和热化学性能的最佳组合。
    DOI:
    10.1021/ma302300g
  • 作为产物:
    描述:
    1,3,5-tris[(4-methoxyphenyl)methyl]benzene吡啶盐酸盐 作用下, 反应 4.0h, 以90%的产率得到1,3,5-tris[(4-hydroxyphenyl)methyl]benzene
    参考文献:
    名称:
    具有增强的段灵活性和出色的热化学稳定性的聚氰尿酸酯网络
    摘要:
    对于完全固化时玻璃化转变温度为320°C的氰酸酯网络,其相对较低。当在210°C下固化24小时时,网络的干玻璃转变温度范围为245至285°C,而湿玻璃转变温度范围为225至240°C。玻璃化转变温度的相似性是由于具有更刚性链段的网络中较低的固化程度所致。本质上,对于完全固化时玻璃化转变温度非常高的网络,工艺条件而不是网络的刚性决定了可达到的玻璃化转变温度。由于固化程度较高的网络往往表现出较慢的长期降解,因此在这种情况下,尽管在完全固化时表现出较低的玻璃化转变温度,但具有更大片段柔性的网络仍可实现出色的性能。这些结果说明,与用于改善高温热固性聚合物网络性能的流行试探法相反,在完全固化时具有较低玻璃化转变温度的更灵活的网络可以提供热机械性能和热化学性能的最佳组合。
    DOI:
    10.1021/ma302300g
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文献信息

  • RESIN COMPOSITION
    申请人:Asahi Kasei Chemicals Corporation
    公开号:EP1801160A1
    公开(公告)日:2007-06-27
    It is an object to provide a resin composition in which fluidity is conferred while maintaining the high heat resistance of a highly heat-resistant non-crystalline resin, an amount of foreign matter is greatly reduced, there is no mold deposit, the metering stability is excellent, and the transparency is also good, and a resin composition in which good heat resistance and fluidity are both achieved, the amount of foreign matter is reduced, generation of fines is reduced, and there is no bleeding out. According to the present invention, there is provided a resin composition comprising; (A) a resin component comprising 70 to 100 % by weight of at least one resin selected from the group consisting of a polyphenylene ether resin, a polycarbonate resin, a polysulfone resin, a polyethersulfone resin, a polyarylate resin, a polyamide-imide resin, a polyetherimide resin, and a thermoplastic polyimide resin; and (B) an organic compound having a melting point of not less than 200°C, the organic compound being from 0.1 to 40 parts by weight based on 100 parts by weight of the resin component (A).
    本发明的目的是提供一种树脂组合物,该树脂组合物在保持高耐热性非结晶树脂的高耐热 性的同时,还具有流动性,异物量大大减少,没有模具沉积物,计量稳定性极佳,透明性也 很好,同时还具有良好的耐热性和流动性,减少了异物量,减少了细粉的产生,没有渗出。根据本发明,提供了一种树脂组合物,该树脂组合物包括:(A) 一种树脂成分,该树脂成分包含至少一种选自以下组别的树脂,其重量百分比为 70% 至 100%:聚苯醚树脂、聚碳酸酯树脂、聚砜树脂、聚醚砜树脂、聚芳酯树脂、聚酰胺-酰亚胺树脂、聚醚酰亚胺树脂和热塑性聚酰亚胺树脂;以及 (B) 一种有机化合物,该有机化合物的熔点不低于 200°C,有机化合物的重量百分比为 0.以 100 份树脂组分(A)的重量计,有机化合物的重量为 0.1 至 40 份。
  • Resin composition
    申请人:Asahi Kasei Chemicals Corporation
    公开号:EP2161305A2
    公开(公告)日:2010-03-10
    It is an object to provide a resin composition in which fluidity is conferred white maintaining the high heat resistance of a highly heat-resistant non-crystalline resin, an amount of foreign matter is greatly reduced, there is no mold deposit, the metering stability is excellent, and the transparency is also good, and a resin composition in which good heat resistance and fluidity are both achieved, the amount of foreign matter is reduced, generation of fines is reduced, and there is no bleeding out. According to the present invention, there is provided a resin composition comprising; (A) a resin component comprising 70 to 100 % by weight of at least one resin selected from the group consisting of a polyphenylene ether resin, a polycarbonate resin, a polysulfone resin, a polyethersulfone resin, a polyarylate resin, a polyamide-imide resin, a polyetherimide resin, and a thermoplastic polyimide resin; and (B) an organic compound having a melting point of not less than 200°C, the organic compound being from 0.1 to 40 parts by weight based on 100 parts by weight of the resin component (A).
    本发明的目的是提供一种树脂组合物,该树脂组合物在保持高耐热性非结晶树脂的高耐 热性的同时,还具有流动性,异物量大大减少,没有模具沉积物,计量稳定性极佳,透 明性也很好,同时还具有良好的耐热性和流动性,减少了异物量,减少了细粉的产生, 没有渗出。根据本发明,提供了一种树脂组合物,该树脂组合物包括:(A) 一种树脂成分,该树脂成分包含至少一种选自以下组别的树脂,其重量百分比为 70% 至 100%:聚苯醚树脂、聚碳酸酯树脂、聚砜树脂、聚醚砜树脂、聚芳酯树脂、聚酰胺-酰亚胺树脂、聚醚酰亚胺树脂和热塑性聚酰亚胺树脂;以及 (B) 一种有机化合物,该有机化合物的熔点不低于 200°C,有机化合物的重量百分比为 0.以 100 份树脂组分(A)的重量计,有机化合物的重量为 0.1 至 40 份。
  • EPOXY RESIN COMPOSITION
    申请人:Sumitomo Seika Chemicals Co., Ltd.
    公开号:EP3683270A1
    公开(公告)日:2020-07-22
    There is provided an epoxy resin composition having excellent adhesion to copper and aluminum, and having excellent flexibility in a low-temperature environment. The epoxy resin composition comprises (A) an epoxy resin and (B) a polyamide-based rubber elastomer powder.
    本发明提供了一种环氧树脂组合物,该组合物对铜和铝具有极佳的粘附性,并且在低温环境下具有极佳的柔韧性。环氧树脂组合物包括 (A) 环氧树脂和 (B) 聚酰胺基橡胶弹性体粉末。
  • LIQUID COMPOSITION, QUANTUM DOT-CONTAINING FILM, OPTICAL FILM, LUMINESCENT DISPLAY ELEMENT PANEL, AND LUMINESCENT DISPLAY DEVICE
    申请人:TOKYO OHKA KOGYO CO., LTD.
    公开号:EP3812805A1
    公开(公告)日:2021-04-28
    The present invention provides: a liquid composition which can be suitably used for production of an optical film having a favorable fluorescence efficiency and includes quantum dots (A), a quantum dot-containing film obtained by drying and/or curing the liquid composition, an optical film for a light-emitting display element made of the quantum dot-containing film, a light-emitting display element panel including the optical film, and a light-emitting display equipped with the light-emitting display element panel. An ionic liquid (B), and a solvent (S) are incorporated into a liquid composition including quantum dots (A), in which the solvent (S) includes a solvent (S1), the solvent (S1) being a compound having a cyclic skeleton and including a heteroatom other than a hydrogen atom and a carbon atom.
    本发明提供:一种可适当用于生产具有良好荧光效率且包括量子点(A)的光学薄膜的液体组合物、一种通过干燥和/或固化该液体组合物而获得的含量子点薄膜、一种由该含量子点薄膜制成的用于发光显示元件的光学薄膜、一种包括该光学薄膜的发光显示元件面板,以及一种配备有该发光显示元件面板的发光显示器。在包括量子点(A)的液体组合物中加入离子液体(B)和溶剂(S),其中溶剂(S)包括溶剂(S1),溶剂(S1)是具有环状骨架并包括除氢原子和碳原子之外的杂原子的化合物。
  • CURABLE RESIN COMPOSITION, FILM, LAMINATE AND DISPLAY DEVICE
    申请人:Sumitomo Chemical Company, Limited
    公开号:EP3875493A1
    公开(公告)日:2021-09-08
    An object of the present invention is to provide a curable composition comprising a fluorescent particle containing a perovskite compound and a photopolymerizable compound, with a good dispersibility of the above semiconductor particle to the above photopolymerizable compound; a film formed by curing the curable composition; and a laminated body and a display apparatus comprising the film. Provided are a curable composition comprising a fluorescent particle (A) containing a perovskite compound, a photopolymerizable compound (B), and a dispersing agent (C), wherein the dispersing agent (C) includes at least one kind of compound selected from the group consisting of phosphoric acid compounds, carboxylic acid compounds, sulfonic acid compounds, primary to tertiary amine compounds, quaternary ammonium compounds, and thiol compounds; a film formed by curing the curable composition; and a laminated body and a display apparatus comprising the film.
    本发明的目的是提供一种可固化组合物,该组合物包含一种含有包晶化合物和可光聚合化合物的荧光颗粒,上述半导体颗粒对上述可光聚合化合物具有良好的分散性;通过固化该可固化组合物形成的薄膜;以及包含该薄膜的层压体和显示装置。本发明提供了一种可固化组合物,该组合物包括含有过氧化物化合物的荧光颗粒(A)、可光聚合化合物(B)和分散剂(C),其中分散剂(C)包括至少一种选自磷酸化合物、羧酸化合物、磺酸化合物、伯至叔胺化合物、季铵化合物和硫醇化合物组成的组的化合物;通过固化该可固化组合物形成的薄膜;以及包含该薄膜的层压机身和显示设备。
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