A resin composition which contains a binder resin (A), radiation-sensitive compound (B), silane-modified resin (C), and antioxidant (D), wherein a content of the silane-modified resin (C) is 0.1 to 150 parts by weight with respect to 100 parts by weight of the binder resin (A), a content of the antioxidant (D) is 0.1 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A), and an amount of warping is 14 μm or less when using the resin composition to form a thickness 2 to 3 μm resin film and baking the formed resin film at 230° C. is provided.
RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT
申请人:Zeon Corporation
公开号:EP3121651A1
公开(公告)日:2017-01-25
A radiation-sensitive resin composition comprising a binder resin (A), a radiation-sensitive compound (B), a tetrafunctional or lower functional epoxy-based cross-linking agent (C) having an epoxy equivalent of 450 or less and a softening point of 30°C or less, and an aralkyl phenol resin (D) is provided. According to the present invention, it is possible to provide a radiation-sensitive resin composition able to give a resin film high in adhesion to a metal layer and excellent in developability and low hygroscopicity.
RADIATION-SENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC COMPONENT
申请人:Zeon Corporation
公开号:EP3136173A1
公开(公告)日:2017-03-01
There are provided a radiation-sensitive resin composition comprising a binder resin (A), radiation-sensitive compound (B), and cross-linking agent (C) represented by the following general formula (1), whereina content of the cross-linking agent (C) is 3 to 25 parts by weight with respect to 100 parts by weight of the binder resin (A):
wherein, in the general formula (1), each of R1 to R3 independently represents a hydrocarbon group having 1 to 10 carbon atoms.
A resin composition comprising a binder resin (A), a phenoxy resin having a hydroxyl equivalent of 300 or more, and a cross-linking agent (C). The resin composition of the present invention preferably further comprises a photoacid generator (D). The photoacid generator (D) is more preferably a quinone diazide compound.
RADIATION SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT
申请人:Zeon Corporation
公开号:EP3438746A1
公开(公告)日:2019-02-06
A radiation-sensitive resin composition comprising a cyclic olefin polymer (A) having a protonic polar group, a bifunctional epoxy compound (B) represented by the following general formula (1), and a radiation-sensitive compound (C):
wherein, in the above general formula (1), R1 is a linear chain or branched alkylene group having 1 to 15 carbon atoms, and "k" is an integer of 1 to 20, is provided.