A room temperature alternative of the Claisen rearrangement route to ortho allylated phenols: unique reactivity pattern of allylindium reagents
作者:Dipakranjan Mal、Pallab Pahari、Bidyut K. Senapati
DOI:10.1016/j.tetlet.2005.01.152
日期:2005.3
Quinol ethers and quinone monoketals are shown to undergo formal anti-Michael addition reactions with allylindium reagents at room temperature to give only ortho allylated phenols in good yields.
作者:Sarah A. French、Christopher J. Sumby、David M. Huang、Jonathan H. George
DOI:10.1021/jacs.2c09978
日期:2022.12.21
Inspired by a new biosynthetic hypothesis, we report a biomimetic totalsynthesis of atrachinenins A and B that explains their racemic nature. The synthesis exploits an intermolecular Diels–Alder reaction between a quinone meroterpenoid and E-β-ocimene, followed by intramolecular (3 + 2) cycloaddition and a late-stage aerobic oxidation. Divergent transformations of a simple model system gave several
受新的生物合成假设的启发,我们报告了 atrachinenins A 和 B 的仿生全合成,这解释了它们的外消旋性质。该合成利用了醌类萜类化合物和E -β-罗勒烯之间的分子间 Diels-Alder 反应,然后是分子内 (3 + 2) 环加成和后期有氧氧化。一个简单模型系统的发散转变给出了几个复杂的多环支架,同时也暗示了 atrachinenin C 的结构修正。
ACTIVE ESTER RESIN AND COMPOSITION AND CURED PRODUCT USING THE SAME
申请人:DIC Corporation
公开号:US20200216603A1
公开(公告)日:2020-07-09
The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided is an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has an unsaturated bond-containing substituent.
CURABLE COMPOSITION AND CURED PRODUCT THEREOF
申请人:DIC Corporation
公开号:US20210009804A1
公开(公告)日:2021-01-14
A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.
[EN] CURABLE COMPOSITION AND CURED PRODUCT OF SAME<br/>[FR] COMPOSITION DURCISSABLE ET SON PRODUIT DURCI<br/>[JA] 硬化性組成物及びその硬化物