4-(4-Aminophenyl)sulfanylbenzoic acid | 126585-18-0

• 分子结构分类: 有机化合物 - 有机硫化合物 - 硫醚类
• 英文名称: 4-(4-Aminophenyl)sulfanylbenzoic acid
• CAS: 126585-18-0
• 化学式: C₁₃H₁₁NO₂S
• 分子量: 245.302
• InChiKey: XRLMLNFQXZPRKQ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.9
• 重原子数：
  17
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  88.6
• 氢给体数：
  2
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  4-(4-Aminophenyl)sulfanylbenzoic acid 以 溶剂黄146 、 乙腈 为溶剂， 反应 17.0h， 生成 4-[4-[[2-(diethylamino)acetyl]amino]phenyl]sulfanylbenzoic acid
  参考文献：
  名称：

  Bethegnies; Marcincal-Lefebvre; Brunet, Il Farmaco, 1989, vol. 44, # 7-8, p. 683 - 694

  摘要：

  DOI：
• 作为产物：
  描述：

  p-Nitrophenylthiobenzoesaeure 在 镍 氢气 作用下， 以 乙醇 为溶剂， 60.0 ℃ 、10.34 MPa 条件下， 反应 4.0h， 以75%的产率得到4-(4-Aminophenyl)sulfanylbenzoic acid
  参考文献：
  名称：

  Bethegnies; Marcincal-Lefebvre; Brunet, Il Farmaco, 1989, vol. 44, # 7-8, p. 683 - 694

  摘要：

  DOI：

文献信息

• HYBRID EPOXY RESINS
  申请人：DOW GLOBAL TECHNOLOGIES LLC

  公开号：US20140114047A1

  公开（公告）日：2014-04-24

  A hybrid polyfunctional aliphatic and/or cycloaliphatic epoxy (H-PACE) resin composition comprising, consisting of or consisting essentially of: (a) a moiety selected from the group consisting of an aliphatic moiety, a cycloaliphatic moiety, and combinations thereof provided by the polyfunctional aliphatic and/or cycloaliphatic epoxy (PACE) resin; and (b) a moiety selected from the group consisting of an aliphatic moiety, a cycloaliphatic moiety, and combinations thereof, wherein said moiety is not provided by the PACE resin, is disclosed. Processes for making and using such resin composition are also disclosed.

  本发明涉及一种混合多功能脂肪族和/或环脂族环氧（H-PACE）树脂组合物，包括、由以下成分组成或实质上由以下成分组成：（a）由多功能脂肪族和/或环脂族环氧（PACE）树脂提供的脂肪族、环脂族或两者的一部分；以及（b）由不由PACE树脂提供的脂肪族、环脂族或两者的一部分。本发明还公开了制备和使用这种树脂组合物的方法。
• Improved process for forming thermally stable thermotropic liquid crystalline polyesters of predetermined chain length
  申请人：CELANESE CORPORATION

  公开号：EP0133024A2

  公开（公告）日：1985-02-13

  An improved polymerisation process is provided for the formation of a polyester which is capable of forming an anisotropic melt phase and which optionally may include amide linkages. An approximately 0.4 to 3 percent molar excess of aromatic dicarboxylic acid monomer (e.g. terephthalic acid) and/or an esterified derivative thereof is provided in the polymerisation zone during the polymerisation reaction. Such monomer imparts dicarboxyaryl units to the interior of the resulting polymer chains and causes the polymer chains to terminate in carboxylic acid end groups and/or an esterified derivative thereof wherein the polymer chains achieve a predetermined average chain lengththrough the depletion of other monomers present in the polymerisation zone. The resulting polyester unlike the usual product of the prior art is substantially incapable of additional chain growth upon subsequent heating and accordingly may be relied upon to maintain a substantially constant viscosity during melt processing regardless of the duration of heating.

  本发明提供了一种改进的聚合工艺，用于形成一种可形成各向异性熔体相的聚酯，该聚酯可选择性地包括酰胺连接。在聚合反应过程中，在聚合区中加入约 0.4%至 3%摩尔过量的芳香族二羧酸单体（如对苯二甲酸）和/或其酯化衍生物。这种单体将二羧基芳基单元赋予所产生的聚合物链的内部，并使聚合物链以羧酸末端基团和/或其酯化衍生物终止，其中聚合物链通过耗尽聚合区中存在的其他单体而达到预定的平均链长。由此产生的聚酯与现有技术中的普通产品不同，在后续加热过程中基本上不会产生额外的链增长，因此在熔融加工过程中，无论加热时间长短，都能保持基本恒定的粘度。
• Moulding compositions for the encapsulation of electronic components
  申请人：CELANESE CORPORATION

  公开号：EP0135310A2

  公开（公告）日：1985-03-27

  (D An improved thermoplastic moulding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mould cavity prior to the introduction of the moulding composition via injection moulding. The moulding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves advantageously to decrease its volumetric coefficient of thermal expansion and advantageously to increase its thermal conductivity. In a preferred embodiment the electronic component which is encapsulated is a semiconductor device, such as a relatively delicate quad or dual-in-line integrated circuit device which is assembled onto a flat prestamped lead frame or other conductive device having a plurality of leads which extend outside the area which is encapsulated. The resulting encapsulated electronic component is well protected in spite of the relatively low molecular weight of the liquid crystalline polymer and is capable of satisfactory service for an extended period of time even if adverse environmental conditions are encountered. A rugged commonly non-burning and relatively inexpensive package is provided.

  (D) 提供了一种改进的热塑性模塑组合物，该组合物特别适用于在相对较快的基础 上对电子元件进行不透水无空隙封装，其中在通过注塑成型引入模塑组合物之 前，将预制电子元件置于模腔中。模塑组合物包括一种可熔融加工的热致性液晶聚合物，其平均分子量相对较低，约为 4,000 至 25,000 （例如约为 4,000 至 10,000），并且在加热时基本上不能再发生链增长。均匀地分散在液晶聚合物中的颗粒状无机材料（最好是二氧化硅）的重量百分比约为 40%至 80%（例如约为 50%至 75%），可降低其体积热膨胀系数并提高其热导率。在一个优选的实施方案中，被封装的电子元件是一个半导体器件，如一个相对精致的四线或双线集成电路器件，它被装配在一个扁平的预冲压引线框架或其他导电装置上，该导电装置有多条引线，这些引线延伸到被封装区域之外。尽管液晶聚合物的分子量相对较低，但封装后的电子元件仍受到很好的保护，即使遇到不利的环境条件，也能在较长的时间内提供令人满意的服务。这种封装坚固耐用，通常不会燃烧，而且成本相对较低。
• Polymer modified adducts of epoxy resins and active hydrogen containing compounds containing mesogenic moieties
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0469492A2

  公开（公告）日：1992-02-05

  Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more mesogenic or rodlike moieties. These adducts are useful as epoxy resin curing agents.

  聚合物改性加合物的制备方法是：(A)将(1)具有平均一个以上副环氧基团的环氧树脂与(2)含有平均两个或两个以上与环氧基团反应的氢原子的化合物反应；以及(B)将步骤(A)的产物部分乙烯基化；(C) 将步骤(B)的部分乙烯基化产物与(3)可聚合的乙烯基不饱和单体聚合；但条件是组分(1)、(2)或(3)中至少有一种含有一个或多个介原或棒状分子。这些加合物可用作环氧树脂固化剂。
• Adducts of epoxy resins and active hydrogen containing compounds containing mesogenic moieties
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0478918A2

  公开（公告）日：1992-04-08

  Adducts containing mesogenic or rodlike moieties are prepared by reacting (1) at least one compound containing an average of more than one vicinal epoxide group per molecule with (2) at least one compound containing an average of more than one reactive hydrogen atom per molecule; with the proviso that at least one member of components (1) and (2) contains a mesogenic or rodlike moiety. These compounds are useful as curing agents for epoxy resins.

  含有中间体或棒状分子的加合物是通过以下反应制备的：(1) 至少一种平均每分子含有一个以上邻位环氧基团的化合物与 (2) 至少一种平均每分子含有一个以上活性氢原子的化合物；但(1)和(2)组分中至少有一个成员含有中间体或棒状分子。这些化合物可用作环氧树脂的固化剂。