Maleimide compositions and methods for use thereof
申请人:Dershem Stephen
公开号:US20080075965A1
公开(公告)日:2008-03-27
The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a catalyst. In some embodiments, the well-known “ene” reaction can be used to cure the compositions described herein, and therefore no catalyst is required.