COMPOUND FOR FORMING ORGANIC FILM, COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US20170184968A1
公开(公告)日:2017-06-29
A compound for forming an organic film shown by the formula (1A),
R—(—X)
m1
(1A)
wherein R represents a single bond or an organic group having 1 to 50 carbon atoms; X represents a group shown by formula (1B); and ml represents an integer satisfying 2≦m1≦10,
wherein X
2
represents a divalent organic group having 1 to 10 carbon atoms; n1 represents 0 or 1; n2 represents 1 or 2; X
3
represents a group shown by the formula (1C); and n5 represents 0, 1, or 2,
wherein R
10
represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 10 carbon atoms, wherein a hydrogen atom of the benzene ring in formula (1C) may be substituted with a methyl group or methoxy group. This compound for forming an organic film can provide organic film composition having good dry etching resistance, heat resistance to 400° C. or higher, high filling and planarizing properties.
一种用于形成有机薄膜的化合物,其化学式为(1A),R—(—X)m1(1A),其中R代表一个单键或具有1至50个碳原子的有机基团;X代表化学式(1B)所示的基团;m1代表满足2≦m1≦10的整数,其中X2代表具有1至10个碳原子的二价有机基团;n1代表0或1;n2代表1或2;X3代表化学式(1C)所示的基团;n5代表0、1或2,其中R10代表氢原子或具有1至10个碳原子的饱和或不饱和碳氢基团,化学式(1C)中苯环的氢原子可能被甲基基团或甲氧基取代。这种用于形成有机薄膜的化合物可以提供具有良好干法刻蚀抗性、耐高温至400°C或更高、高填充和平整化性能的有机薄膜组合物。