2,2-bis[3-allyl-4-(glycidyloxy)phenyl]hexafluoropropane | 1284287-88-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2,2-bis[3-allyl-4-(glycidyloxy)phenyl]hexafluoropropane
• 英文别名: 2-[[4-[1,1,1,3,3,3-Hexafluoro-2-[4-(oxiran-2-ylmethoxy)-3-prop-2-enylphenyl]propan-2-yl]-2-prop-2-enylphenoxy]methyl]oxirane；2-[[4-[1,1,1,3,3,3-hexafluoro-2-[4-(oxiran-2-ylmethoxy)-3-prop-2-enylphenyl]propan-2-yl]-2-prop-2-enylphenoxy]methyl]oxirane
• CAS: 1284287-88-2
• 化学式: C₂₇H₂₆F₆O₄
• 分子量: 528.491
• InChiKey: ZGJYCWXALFUHKE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  7.3
• 重原子数：
  37
• 可旋转键数：
  12
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.41
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  10

反应信息

• 作为反应物：
  描述：

  2,2-bis[3-allyl-4-(glycidyloxy)phenyl]hexafluoropropane 在 (1R,2R)-(-)-N,N'-bis(3,5-di-tert-butylsalicydene)-1,2-cyclohexanediaminocobalt(II) 、 (S,S)-(+)-N,N'-bis(3,5-di-tert-butylsalicylidene)-1,2-cyclohexanediaminocobalt(II) 水 、 溶剂黄146 作用下， 以 四氢呋喃 为溶剂， 反应 72.0h， 以81%的产率得到2,2-bis[3-allyl-4-(2,3-dihydroxypropyloxy)phenyl]hexafluoro-propane
  参考文献：
  名称：

  ALCOHOLIC HYDROXYL-CONTAINING COMPOUNDS AND MAKING METHOD

  摘要：

  既含有醇羟基又含有烯丙基的双酚衍生物是修改有机树脂和硅树脂的新型有用试剂。

  公开号：

  US20110082321A1
• 作为产物：
  描述：

  六氟双酚 A 在 potassium carbonate 、 sodium hydroxide 作用下， 以 水 、 邻二氯苯 、 异丙醇 、 丙酮 为溶剂， 反应 11.0h， 生成 2,2-bis[3-allyl-4-(glycidyloxy)phenyl]hexafluoropropane
  参考文献：
  名称：

  티올-엔 반응을 이용한 비스페놀계 에폭시 화합물 및 그 제조방법, 및 그 경화 생성물을 포함하는 유기-무기재료 복합체 및 그 복합체 제조방법

  摘要：

  本发明涉及具有알科西基-烷基-S-烷基基团的双酚类环氧化合物及其制备方法，以及包含硬化产物的有机-无机材料复合物及其制备方法，更详细地说，本发明涉及新型双酚类环氧化合物及其制备方法，以及包含硬化产物的有机-无机材料复合物，该复合物在制造下一代半导体基板和PCB等高密度和高性能电子元件时表现出改善的耐热性和热膨胀特性，同时提供优异的硬化度。

  公开号：

  KR20170075105A

文献信息

• Alcoholic hydroxyl-containing compounds and making method
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP2316810A1

  公开（公告）日：2011-05-04

  Bisphenol derivatives having both alcoholic hydroxyl and allyl groups are novel and useful as reagents for modifying organic resins and silicone resins.

  具有醇羟基和烯丙基的双酚衍生物是一种新颖且有用的试剂，可用于改性有机树脂和硅树脂。
• Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US10730273B2

  公开（公告）日：2020-08-04

  The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

  本发明是一种树脂组合物，包括：(A) 环氧树脂；(B) 下式 (1) 和/或下式 (2) 所示的环氧化合物；(C) 下式 (3) 所示的环氧化合物；(D) 酚醛固化剂；以及 (E) 固化促进剂、 其中 "A "代表单键或选自下式的二价有机基团。 本发明提供了一种强度提高、翘曲减小、附着力优异的树脂组合物、由该组合物形成的强度提高的树脂膜、含有该树脂膜固化材料的半导体层压板及其制造方法、以及将该半导体层压板切割成小块的半导体器件及其制造方法。
• RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20190070837A1

  公开（公告）日：2019-03-07

  The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.
• US8378148B2
  申请人：——

  公开号：US8378148B2

  公开（公告）日：2013-02-19
• 티올-엔 반응을 이용한 비스페놀계 에폭시 화합물 및 그 제조방법, 및 그 경화 생성물을 포함하는 유기-무기재료 복합체 및 그 복합체 제조방법
  申请人：SAMYANG CORPORATION 주식회사 삼양사(120110515934) Corp. No ▼ 110111-4720945BRN ▼101-86-66838

  公开号：KR20170075105A

  公开（公告）日：2017-07-03

  본 발명은 알콕시실릴알킬-S-알킬기를 갖는 비스페놀계 에폭시 화합물 및 그 제조방법, 및 그 경화 생성물을 포함하는 유기-무기재료 복합체 및 그 복합체 제조방법에 관한 것으로서, 더욱 상세하게는, 차세대 반도체 기판 및 PCB 등의 고집적화 및 고성능의 전자부품 제조에 사용시 개선된 내열성 및 열팽창 특성을 나타내며 경화도도 우수한 복합체를 제공할 수 있는 신규한 비스페놀계 에폭시 화합물 및 그 제조방법, 및 그 경화 생성물을 포함하는 유기-무기재료 복합체 및 그 복합체 제조방법에 관한 것이다.

  本发明涉及具有알科西基-烷基-S-烷基基团的双酚类环氧化合物及其制备方法，以及包含硬化产物的有机-无机材料复合物及其制备方法，更详细地说，本发明涉及新型双酚类环氧化合物及其制备方法，以及包含硬化产物的有机-无机材料复合物，该复合物在制造下一代半导体基板和PCB等高密度和高性能电子元件时表现出改善的耐热性和热膨胀特性，同时提供优异的硬化度。