Compounds of the general formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 are herein described, A is a straight or branched (C.sub.2 -C.sub.12)alkyl or a phenyl moiety and B is a moiety of the formula: ##STR2## The compounds are effective in potentiating the activity of chemotherapeutic anti-cancer agents by increasing the sensitivity of multi-drug resistant cells to such chemotherapeutic agents.
Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus
申请人:ASAHI KASEI KABUSHIKI KAISHA
公开号:US10831101B2
公开(公告)日:2020-11-10
A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.
El'tsov,A.V., Journal of Organic Chemistry USSR (English Translation), 1965, vol. 1, p. 1847 - 1857
作者:El'tsov,A.V.
DOI:——
日期:——
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS
申请人:ASAHI KASEI KABUSHIKI KAISHA
公开号:US20190113845A1
公开(公告)日:2019-04-18
A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.