The present invention provides methods of making low energy polymerizable monomers and resins for use in making dielectric materials. The methods comprise deprotecting or deacylating an organic alkali cleavable protecting group containing addition polymerizable, amine containing aromatic monomer or oligoaromatic phenol resin containing an organic alkali cleavable protecting group, such as a C
2
to C
9
alkanoyl group, preferably, an acyl group, by hydrolyzing to remove the protecting group in organic alkali in a polar solvent containing an excess of alkali C
1
to C
7
alkoxide and form a hydroxyl functional monomer or resin, followed by; reacting via nucleophilic substitution the resulting hydroxyl functional monomer or resin with an alpha-halide (α-halide) or strong acid conjugate leaving group containing arylcyclobutene compound in a polar solvent, to yield a product an arylcyclobutene-containing addition polymerizable or amine containing aromatic monomer or oligoaromatic phenol resin having an ether linkage from the cyclobutene ring to an aromatic group of the addition polymerizable aromatic monomer, aromatic amine or oligoaromatic phenol.
本发明提供了制备低能量聚合单体和
树脂的方法,用于制造介电材料。该方法包括去保护有机碱可解除保护基,其中包含加成聚合、胺含量芳香单体或寡聚芳香
酚树脂,该保护基是有机碱可解除的保护基,例如C2至C9烷酰基,优选为酰基,通过在含有过量碱C1至C7醇酸盐的极性溶剂中
水解去除保护基,形成羟基官能单体或
树脂,然后通过亲核取代反应,在极性溶剂中与含有芳基
环丁烯化合物的α-卤代物或强酸共轭离去基反应,得到含有芳基
环丁烯的加成聚合或胺含量芳香单体或寡聚芳香
酚树脂产物,其
环丁烯环上有一个醚键,连接到加成聚合芳香单体、芳香胺或寡聚芳香
酚的芳香基上。