pentyl undecanoate | 10484-11-4

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: pentyl undecanoate
• 英文别名: undecanoic acid pentyl ester；Undecansaeure-pentylester；Pentylundecylat
• CAS: 10484-11-4
• 化学式: C₁₆H₃₂O₂
• 分子量: 256.429
• InChiKey: RDOSVFWJFQNBEL-UHFFFAOYSA-N

物化性质

• 沸点：
  305.5±10.0 °C(Predicted)
• 密度：
  0.865±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  6.5
• 重原子数：
  18
• 可旋转键数：
  14
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.94
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  pentyl undecanoate 在 氢氧化钾 作用下， 以 乙醇 为溶剂， 反应 1.0h， 生成 十一烷酸
  参考文献：
  名称：

  Mehta; Gupta, Meenal; Verma, Manjul, Indian Journal of Chemistry - Section B Organic and Medicinal Chemistry, 2006, vol. 45, # 6, p. 1567 - 1571

  摘要：

  DOI：
• 作为产物：
  描述：

  戊醇 、 十一烷酸 在 盐酸 作用下， 生成 pentyl undecanoate
  参考文献：
  名称：

  Ruhoff; Reid, Journal of the American Chemical Society, 1933, vol. 55, p. 3827

  摘要：

  DOI：

文献信息

• Diacylglycerin and cosmetic composition
  申请人：KAO CORPORATION

  公开号：EP0391431A1

  公开（公告）日：1990-10-10

  The following diacylglycerin is useful for a cosmetic oil and a cosmetic composition such as pack, cream and emulsion. (where one each of R₁, R₂, and R₃ denotes a residue of a straight-chain saturated fatty acid having 11-17 carbon atoms, a residue of a branched-chain saturated fatty acid having 10-18 carbon atoms, and a hydrogen atom)

  以下二酰甘油可用于化妆品油和化妆品组合物，如包装、膏霜和乳液。 (其中 R₁、R₂ 和 R₃ 各表示一个具有 11-17 个碳原子的直链饱和脂肪酸残基、一个具有 10-18 个碳原子的支链饱和脂肪酸残基和一个氢原子）。
• COMPOSITION FOR PROTECTION OF BODY SURFACE
  申请人：Asahi Kasei Chemicals Corporation

  公开号：EP1891924A1

  公开（公告）日：2008-02-27

  A body surface protecting composition, comprising at least one type of multi-chain multiple hydrophilic group-type compound having two or more hydrophobic groups and two or more hydrophilic groups in the molecule, which has an excellent effect of accelerating the recovery of the barrier function of skin and hair and preventing degradation of that function.

  一种体表保护组合物，包含至少一种多链多亲水基团型化合物，其分子中含有两个或两个以上的疏水基团和两个或两个以上的亲水基团，该组合物在加速恢复皮肤和头发的屏障功能以及防止该功能退化方面具有极佳的效果。
• METHOD FOR PRODUCING CROSS-COUPLING COMPOUND
  申请人：Kao Corporation

  公开号：EP2143705A1

  公开（公告）日：2010-01-13

  To provide a method for performing a cross-coupling reaction of a Grignard compound with an alkyl halide simply, efficiently and in high yield, a method for obtaining a ω-bromo long chain carboxylic acid simply and efficiently using an easily obtainable raw material and a method for producing a useful branched fatty acid simply and efficiently. [R1: an alkyl group having 1 to 15 carbon atoms, R2: an alkyl group having 1 to 30 carbon atoms with a carboxyl group and X and X': a halogen atom] [n : an integer of 9 to 17] [n : an integer of 9 to 17, R1a : a branched alkyl group having 3 to 8 carbon atoms and X: a halogen atom]

  提供一种简单、高效、高产率地进行格氏化合物与烷基卤化物的交叉偶联反应的方法，一种利用易得原料简单、高效地获得ω-溴长链羧酸的方法，以及一种简单、高效地生产有用支链脂肪酸的方法。 [R1：具有 1 至 15 个碳原子的烷基，R2：具有 1 至 30 个碳原子并带有一个羧基的烷基，X 和 X'：卤素原子]。 [n：9 至 17 的整数］ [n：9 至 17 的整数，R1a：具有 3 至 8 个碳原子的支链烷基，X：卤素原子］
• COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTOR DEVICE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP3569329A1

  公开（公告）日：2019-11-20

  A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 µm and less than or equal to 0.8 µm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 µm and less than or equal to 50 µm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300°C, and a content of the solvent having a boiling point of higher than or equal to 300°C is greater than or equal to 2 mass% on the basis of a total mass of the copper paste for pressureless bonding.

  一种用于无压粘接的铜浆料是一种用于无压粘接的铜浆料，包含：金属颗粒；以及一种分散介质，其中金属颗粒包括体积平均颗粒直径大于或等于0.01微米且小于或等于0.8微米的亚微型铜颗粒，以及体积平均颗粒直径大于或等于2.0 µm且小于或等于50 µm，分散介质中含有沸点高于或等于300°C的溶剂，且沸点高于或等于300°C的溶剂的含量大于或等于无压键合用铜浆总质量的2%。
• Copper paste for pressureless bonding, bonded body and semiconductor device
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US10930612B2

  公开（公告）日：2021-02-23

  A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 μm and less than or equal to 0.8 μm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 μm and less than or equal to 50 μm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.

  一种用于无压粘接的铜膏是一种用于无压粘接的铜膏，包含：金属颗粒；和分散介质，其中金属颗粒包括体积平均颗粒直径大于或等于 0.01 μm 且小于或等于 0.8 μm 的亚微型铜颗粒，以及体积平均颗粒直径大于或等于 2.0 μm 且小于或等于 50 μm 的微型铜颗粒，分散介质包含沸点高于或等于 300°C 的溶剂、沸点高于或等于 300 摄氏度的溶剂的含量大于或等于无压接合铜浆总质量的 2%。