An object of the present invention is to provide a resin composition that is curable at a low temperature of 80°C or lower, preferably at room temperature, and that only contains a small amount of components that volatilize during use (application) or curing and is suitable as a one-part adhesive for use in the manufacture of an image sensor module or an electronic component.
The resin composition of the present invention contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.
本发明的目的是提供一种
树脂组合物,该
树脂组合物可在 80°C 或更低的低温下固化,最好是在室温下固化,并且只含有少量在使用(涂抹)或固化过程中挥发的成分,适合作为单组分粘合剂用于制造图像传感器模块或电子元件。
本发明的
树脂组合物含有一种或多种 2-亚甲基-1,3-二羰基化合物。一种或多种 2-亚甲基-1,3-二羰基化合物中至少有一种的分子量为 220 至 10,000,分子量小于 220 的 2-亚甲基-1,3-二羰基化合物相对于整个
树脂组合物 1 的重量比为 0.00 至 0.05。2-亚甲基-1,3-二羰基化合物含有下式(I)所代表的结构单元。