申请人:Ishida Hatsuo
公开号:US20070191555A1
公开(公告)日:2007-08-16
The invention provides a thermosetting resin composition comprising a bifunctional dihydrobenzoxazine compound and an epoxy compound, and provides a thermosetting resin molding obtained by thermally curing the thermosetting resin composition. The molding has excellent electric properties of low dielectric constant and low dielectric loss tangent. The resin composition comprises an epoxy compound and a bifunctional dihydrobenzoxazine compound of the following general formula (1), wherein the equivalent ratio of the epoxy compound to the bifunctional dihydrobenzoxazine compound is 1/(0.1 to 20):
wherein R represents a linear alkylene group having at least 2 carbon atoms, or a branched alkylene group derived from it by substituting the hydrogen atom therein with an alkyl group, and the hydrogen atom of the benzene ring may be substituted with an alkyl group or an alkoxy group.
本发明提供一种热固性树脂组合物,包括双官能二氢苯并噁嗪化合物和环氧化合物,并提供通过热固化所得的热固性树脂成型品。该成型品具有低介电常数和低介电损耗正切的优异电学性能。该树脂组合物包括环氧化合物和具有以下一般式(1)的双官能二氢苯并噁嗪化合物,其中环氧化合物与双官能二氢苯并噁嗪化合物的当量比为1 /(0.1至20):其中R表示具有至少2个碳原子的线性烷基或由其派生的支链烷基,其中将其中的氢原子用烷基取代,并且苯环的氢原子可以被烷基或烷氧基取代。