2,2'-methylenebis{4-methyl-6-(3,5-dimethyl-4-aminobenzyl)phenol}

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: 2,2'-methylenebis{4-methyl-6-(3,5-dimethyl-4-aminobenzyl)phenol}
• 英文别名: 2-[(4-Amino-3,5-dimethylphenyl)methyl]-6-[[3-[(4-amino-3,5-dimethylphenyl)methyl]-2-hydroxy-5-methylphenyl]methyl]-4-methylphenol
• 化学式: C₃₃H₃₈N₂O₂
• 分子量: 494.677
• InChiKey: WMTKEXLFSLRHQJ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  7.8
• 重原子数：
  37
• 可旋转键数：
  6
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.27
• 拓扑面积：
  92.5
• 氢给体数：
  4
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  2-(3-羟甲基-2-羟基-5-甲基苄基)-6-羟甲基-4-甲基苯酚 、 2,6-二甲基苯胺 在 草酸 作用下， 以 ethylcellosolve 为溶剂， 反应 4.0h， 生成 2,2'-methylenebis{4-methyl-6-(3,5-dimethyl-4-aminobenzyl)phenol}
  参考文献：
  名称：

  Amino group containing phenol derivative

  摘要：

  公开号：

  EP1361208B1

文献信息

• Amino group containing phenol
  申请人：Tsuihiji Takeshi

  公开号：US20050197482A1

  公开（公告）日：2005-09-08

  An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R 1 , R 2 and R 3 , which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R 4 and R 5 , which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO 2 —, —C(CH 3 ) 2 —, —CH 2 —, —C(CH 3 )(C 2 H 5 )—, or —C(CF 3 ) 2 —; and n represents an integer of 1 or greater).

  本发明的目的是提供一种材料，它可以解决与聚酰亚胺聚合物有关的缺点，但又保留了传统聚酰亚胺聚合物的优点。 本发明的一种含氨基的苯酚衍生物由以下通式（1）表示，本发明还提供了一种用这种含氨基的苯酚衍生物生产的聚酰亚胺前体。 (其中，R 1 , R 2 和 R 3 可相同或不同，各自代表 1 至 9 个碳原子的烷基、1 至 10 个碳原子的烷氧基、COOR 基团（其中 R 代表 1 至 6 个碳原子的烷基）或氢原子； R 4 4 和 R 5 代表 1 至 9 个碳原子的烷基或氢原子；X 代表-O-、-S-、-SO 2 -、-C（CH 3 ) 2 -，-CH 2 -、-C(CH 3 )(C 2 H 5 )-，或-C(CF 3 ) 2 -；n 表示 1 或更大的整数）。
• Photo-curable resin composition comprising a polyimide, a process for forming a pattern therewith, and a substrate protecting film
  申请人：Kato Hideto

  公开号：US20060079658A1

  公开（公告）日：2006-04-13

  The present invention relates to a photocurable resin composition, wherein the composition comprises:(A) a polyimide resin having one or more primary alcoholic groups with an alcoholic equivalent equal to or less than 3500, said polyimide being soluble in an organic solvent and having a weight average molecular weight of from 5,000 to 500,000; (B) at least one selected from the group consisting of a condensate of an amino compound modified with formalin, optionally further with alcohol, preferably a melamine resin modified with formalin, optionally further with alcohol, and a urea resin with formalin, optionally further with alcohol, and a phenolic compound having, on average, at least two selected from the group consisting of a methylol group and an alkoxy methylol group, and (C) a photoacid generator capable of generating an acid upon irradiation with light of a wavelength of from 240 nm to 500 nm.
• Dicing and die bonding adhesive tape
  申请人：Kozakai Shouhei

  公开号：US20070120271A1

  公开（公告）日：2007-05-31

  A dicing and die bonding tape, comprising a substrate 1 , a pressure sensitive adhesive layer (A) 2 superimposed on the substrate 1 , a substrate 3 superimposed on the pressure sensitive adhesive layer (A) 2 , a pressure sensitive adhesive layer (B) 4 superimposed on the substrate 3 , and an adhesive layer 5 super imposed on the pressure sensitive adhesive layer (B) 4 , said dicing and die bonding tape having an adhesion strength between the pressure sensitive adhesive layer (A) 2 and a dicing flame of 0.6 N/25 mm or larger, and an adhesion strength between the pressure sensitive adhesive layer (B) 4 and the adhesive layer 5 of from 0.05 to 0.5 N/25 mm.
• Adhesive composition, adhesive film, and method of producing semiconductor device
  申请人：Ichiroku Nobuhiro

  公开号：US20070191552A1

  公开（公告）日：2007-08-16

  Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.
• EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE USING SAME
  申请人：Takeda Sayaka

  公开号：US20140005318A1

  公开（公告）日：2014-01-02

  Disclosed is an epoxy resin composition which has excellent workability and excellent thermal resistance after curing. The epoxy resin composition contains a compound which has a specific imide structure obtained by reacting a diamine having a phenolic hydroxyl group, such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), with a tetracarboxylic dianhydride, and which has a number average molecular weight of 1,000 to 5,000; and a compound having at least two epoxy groups, such as a bisphenol A type epoxy resin.