Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof
申请人:Okada Koji
公开号:US20060199920A1
公开(公告)日:2006-09-07
A photosensitive resin composition according to the present invention includes at least a base resin component (A) and a (meth)acryls compound (B), wherein the base resin component (A) is any one of: a polyimide resin (A-1) having at least either a hydroxyl group or a carboxyl group in its structure; a polyamide resin (A-2) having at least either a hydroxyl group or a carboxyl group in its structure; and photosensitive imide(meth)acrylsiloxaneoligomer (A-3). On this account, it is possible to realize characteristics such as (1) realization and improvement of water system developing property, (2) improvement of utility as an imidized film, (3) improvement of post-curing property, and (4) simplification of manufacture of a print wiring substrate. Thus, the photosensitive resin composition can be favorably used particularly in a photosensitive dry film resin, a laminate using the same, a print wiring substrate using the same, and the like.
本发明提供的一种光敏树脂组合物包括至少一种基础树脂组分(A)和一种(甲基)丙烯酸化合物(B),其中基础树脂组分(A)是以下任何一种:具有至少一个羟基或羧基的聚酰亚胺树脂(A-1);具有至少一个羟基或羧基的聚酰胺树脂(A-2);和光敏亚胺(甲基)丙烯酰基硅氧烷低聚物(A-3)。因此,可以实现特性,例如(1)实现和改善水系开发性能,(2)改善作为亚胺化膜的实用性,(3)改善后固化性能,以及(4)简化印刷线路基板的制造。因此,该光敏树脂组合物可以特别有利地用于光敏干膜树脂、使用相同的层压板、使用相同的印刷线路基板等。