Polymerizable compound, polymer, positive resist composition, and patterning process using the same
申请人:Hatakeyama Jun
公开号:US20090297979A1
公开(公告)日:2009-12-03
The present invention provides; a polymer suitable as a base resin for a positive resist composition, in particular a chemically amplified positive resist composition, having a higher resolution, a larger exposure allowance, a smaller sparse-dense size difference, a better process applicability, a better pattern configuration after exposure, and in addition, a further excellent etching resistance, than a conventional positive resist; a positive resist composition using the same; a patterning process; and a novel polymerizable compound to obtain a polymer like this.
The present invention was accomplished by a polymer whose hydrogen atom of at least a carboxyl group is substituted by an acid labile group represented by the following general formula (2), a positive resist composition using the same, a patterning process, and a novel polymerizable compound to obtain a polymer like this.
本发明提供了一种聚合物,适用于作为正向光刻胶组成的基础树脂,特别是化学放大正向光刻胶组成,具有更高的分辨率、更大的曝光容差、更小的稀密差异、更好的工艺适用性、曝光后更好的图案构形,以及比传统正向光刻胶更出色的蚀刻抗性;使用该聚合物的正向光刻胶组成;一种图案化工艺;以及一种新型的可聚合化合物,以获得类似的聚合物。本发明通过一种聚合物实现,其至少一个羧基的氢原子被下述通式(2)所表示的酸敏感基团所取代,使用该聚合物的正向光刻胶组成,一种图案化工艺,以及一种新型的可聚合化合物,以获得类似的聚合物。