3,3'-bis(3,5-dibromophenyl)-5,5',7,7'-tetramethyl-1,1'-biadamantane | 951694-69-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 3,3'-bis(3,5-dibromophenyl)-5,5',7,7'-tetramethyl-1,1'-biadamantane
• 英文别名: 3,3',5,5'-Tetramethyl-7,7'-bis(3,5-dibromophenyl)-1,1'-biadamantane；1-(3,5-dibromophenyl)-3-[3-(3,5-dibromophenyl)-5,7-dimethyl-1-adamantyl]-5,7-dimethyladamantane
• CAS: 951694-69-2
• 化学式: C₃₆H₄₂Br₄
• 分子量: 794.345
• InChiKey: RTMPTDNZHSDEKP-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  14.5
• 重原子数：
  40
• 可旋转键数：
  3
• 环数：
  10.0
• sp3杂化的碳原子比例：
  0.67
• 拓扑面积：
  0
• 氢给体数：
  0
• 氢受体数：
  0

反应信息

• 作为反应物：
  描述：

  3,3'-bis(3,5-dibromophenyl)-5,5',7,7'-tetramethyl-1,1'-biadamantane 、 三甲基乙炔基硅 在 bis-triphenylphosphine-palladium(II) chloride 、 三苯基膦 copper(l) iodide 、 三乙胺 作用下， 以 甲苯 为溶剂， 反应 10.0h， 以73%的产率得到3,3'-bis(3,5-bis(trimethylsilylethynyl)phenyl)-5,5',7,7'-tetramethyl-1,1'-biadamantane
  参考文献：
  名称：

  Ethynylphenylbiadamantane derivatives

  摘要：

  本发明揭示了以下式（1）的卤苯基双螺烷衍生物：其中R1、R2、R3、R4、R5和R6各自独立地代表例如氢原子或具有大约六个或更少碳原子的卤代或未卤代的烷基或环烷基基团，前提是R1到R6中至少有一个代表以下式（2）所表示的取代基：其中X代表卤素原子；“n”表示1到5的自然数，当R1到R6中仅有一个是式（2）的取代基时，那么R1到R6中至少有一个是具有大约六个或更少碳原子的卤代或未卤代的烷基或环烷基基团，或者“n”是2或更多的自然数。该卤苯基双螺烷衍生物可用作各种双螺烷衍生物的中间体材料。

  公开号：

  EP2014636A1
• 作为产物：
  描述：

  1,3-二溴苯 、 3,3'-二溴-5,5',7,7'-四甲基-1,1'-联金刚烷 在 aluminum tri-bromide 作用下， 反应 11.0h， 以90%的产率得到3,3'-bis(3,5-dibromophenyl)-5,5',7,7'-tetramethyl-1,1'-biadamantane
  参考文献：
  名称：

  Ethynylphenylbiadamantane derivatives

  摘要：

  本发明揭示了以下式（1）的卤苯基双螺烷衍生物：其中R1、R2、R3、R4、R5和R6各自独立地代表例如氢原子或具有大约六个或更少碳原子的卤代或未卤代的烷基或环烷基基团，前提是R1到R6中至少有一个代表以下式（2）所表示的取代基：其中X代表卤素原子；“n”表示1到5的自然数，当R1到R6中仅有一个是式（2）的取代基时，那么R1到R6中至少有一个是具有大约六个或更少碳原子的卤代或未卤代的烷基或环烷基基团，或者“n”是2或更多的自然数。该卤苯基双螺烷衍生物可用作各种双螺烷衍生物的中间体材料。

  公开号：

  EP2014636A1

文献信息

• RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME
  申请人：Fujita Kazuyoshi

  公开号：US20090118431A1

  公开（公告）日：2009-05-07

  A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same. In the present invention, the object is achieved by a resin composition comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R 0 is a single bond or has a structure represented by formula (2); R 1 to R 8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R 9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R 1 to R 8 is the group having an alicyclic structure when R 0 is a single bond; at least one of R 1 to R 9 is the group having an alicyclic structure when R 0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.

  本发明的主要目的是提供一种具有高耐热性和低介电常数的树脂组合物，其清漆，树脂膜以及使用该组合物的半导体器件。在本发明中，通过包括具有以下结构的化合物和交联剂的树脂组合物来实现该目标：其中在公式（1）中，R0是单键或具有以下结构的化合物（2）；R1到R8分别为氢、具有脂环结构的基团、具有1到10个碳原子的有机基团（不包括具有脂环结构的基团）、羟基和羧基中的任意一种；“X”是以下任意一种：—O—、—NHCO—、—CONH—、—COO—和—OCO—；此外，在公式（2）中，“Ar”是芳香族基团；“Y”是以下任意一种：单键—O—、—S—、—OCO—和—COO—；“q”是1或更多的整数；当“q”是2或更多的整数时，R9是氢或具有1个或更多碳原子的有机基团，并且可以相同或不同；当R0是单键时，R1到R8中至少有一个是具有脂环结构的基团；当R0具有以下结构的化合物（2）时，R1到R9中至少有一个是具有脂环结构的基团；“*”和“**”表示要与不同化学结构结合的位置。
• ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES
  申请人：MATSUTANI Mihoko

  公开号：US20090318610A1

  公开（公告）日：2009-12-24

  There are provided organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as organic insulating films with low permittivity, high heat resistance and high mechanical strength that employ the same, and semiconductor devices comprising the foregoing. An organic insulating material comprising a compound represented by general formula (1), or a polymer obtained by polymerizing a compound represented by general formula (1), or a mixture of a compound represented by general formula (1) and the polymer. X-VW n Y  (1) (In formula (1), X and Y each independently represent one or more groups with polymerizable functional groups. V and W each represent a group having an adamantane or polyamantane structure, and they may be the same or different. The letter n represents an integer of 0 or greater).

  提供了有机绝缘材料，具有低介电常数、高耐热性和高机械强度，以及采用相同材料的低介电常数、高耐热性和高机械强度的有机绝缘膜，以及包括上述材料的半导体器件。有机绝缘材料包括由通式（1）表示的化合物、由通式（1）表示的化合物聚合得到的聚合物，或通式（1）表示的化合物和聚合物的混合物。X和Y各自独立表示具有可聚合功能基团的一个或多个基团。V和W分别表示具有金刚烷或聚金刚烷结构的基团，它们可以相同也可以不同。字母n表示大于等于0的整数。
• ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE
  申请人：Sano Yohko

  公开号：US20100004379A1

  公开（公告）日：2010-01-07

  The invention provides useful organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as resin films and semiconductor devices employing them. The organic insulating materials of the invention comprise prepolymers of adamantane structure compounds having polymerizable unsaturated bond-containing groups. The prepolymers have number-average molecular weights of between 2,000 and 500,000 based on polystyrene, as measured by gel permeation chromatography. The polymerizable unsaturated bond-containing groups are preferably groups that contain carbon-carbon triple bonds. The resin films of the invention are obtained by crosslinking reaction of the organic insulating materials or varnishes for resin film containing them, by heating and/or active irradiation, and condensation reaction.

  本发明提供了有用的有机绝缘材料，具有低介电常数、高耐热性和高机械强度，以及采用它们的树脂薄膜和半导体器件。本发明的有机绝缘材料包括具有可聚合不饱和键含基团的金刚烷结构化合物的预聚物。根据凝胶渗透色谱法，预聚物的数均分子量在聚苯乙烯基础上为2,000至500,000之间。可聚合不饱和键含基团最好是含有碳-碳三键的基团。本发明的树脂薄膜是通过加热和/或活性辐射以及缩合反应交联反应有机绝缘材料或含有它们的树脂薄膜漆制得的。
• Resin composition, varnish, resin film and semiconductor device using the same
  申请人：Sumitomo Bakelite Company, Ltd.

  公开号：US07863347B2

  公开（公告）日：2011-01-04

  A resin composition is provided comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R0 is a single bond or has a structure represented by formula (2); R1 to R8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond, —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R1 to R8 is the group having an alicyclic structure when R0 is a single bond; at least one of R1 to R9 is the group having an alicyclic structure when R0 has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.

  提供了一种树脂组合物，其包括具有以下结构式（1）表示的化合物和交联剂：在公式（1）中，R0是单键或具有以下结构式（2）表示的结构；R1至R8分别为氢、具有脂环结构的基团、除具有脂环结构的基团外具有1至10个碳原子的有机基团、羟基和羧基中的任何一种；“X”是以下任何一种：—O—、—NHCO—、—CONH—、—COO—和—OCO—；此外，在公式（2）中，“Ar”是芳香基团；“Y”是以下任何一种：单键、—O—、—S—、—OCO—和—COO—；“q”是1或更多的整数；R9是氢或具有1个或多个碳原子的有机基团，当“q”为2或更多的整数时，R9可以相同或不同；当R0为单键时，R1至R8中至少有一个是具有脂环结构的基团；当R0具有以下结构式（2）表示的结构时，R1至R9中至少有一个是具有脂环结构的基团；“*”和“**”表示与不同化学结构结合的位置。
• POLYMER FOR FORMING INSULATING FILM, COMPOSITION FOR FORMING INSULATING FILM, INSULATING FILM, AND ELECTRONIC DEVICE HAVING SAME
  申请人：SANO Yohko

  公开号：US20100130672A1

  公开（公告）日：2010-05-27

  A polymer and composition useful in forming an insulating film provided with a low permittivity, a high heat resistance, and a high mechanical strength and an insulating film obtained from these and an electronic device having the same are provided. The polymer for forming an insulating film according to the present invention is characterized by being obtained by polymerizing a reactive compound represented by Formula (1). The insulating film according to the present invention is formed using a composition for forming an insulating film including that polymer, has molecular spaces having an average space size of 0.7 nm to 5 nm, and has a permittivity of 2.3 or less. The electronic device according to the present invention has the insulating film. (wherein R 1 , R 2 , and R 3 are the same or different from each other and respectively represent an organic group having a ring structure; X and Y are the same or different from each other and respectively represent an aromatic organic group having a reactive group; and n represents 0 or 1).

  本发明提供了一种聚合物和组合物，用于形成具有低介电常数、高耐热性和高机械强度的绝缘膜，以及由此获得的绝缘膜和具有相同绝缘膜的电子设备。根据本发明，用于形成绝缘膜的聚合物的特点在于通过聚合由式（1）表示的反应性化合物获得。根据本发明，使用包括该聚合物的形成绝缘膜的组合物形成绝缘膜，具有平均空间尺寸为0.7nm至5nm的分子空间，并具有介电常数小于2.3。根据本发明的电子设备具有该绝缘膜。（其中，R1、R2和R3彼此相同或不同，分别表示具有环状结构的有机基团；X和Y彼此相同或不同，分别表示具有反应性基团的芳香有机基团；n表示0或1）。