RESIN COMPOSITION AND CURED MATERIAL OF SAME, ADHESIVE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
申请人:Namics Corporation
公开号:EP3747933A1
公开(公告)日:2020-12-09
Provided is a resin composition that has high moisture resistance reliability after curing (particularly, high shear strength after a moisture resistance test), is curable at low temperature, and has light curing properties and heat curing properties. There are also provided an adhesive agent containing this resin composition, a cured product of the resin composition, a semiconductor device containing this cured product, and an electronic component containing the semiconductor device. The resin composition includes (A) a multifunctional (meth)acrylate resin, (B) a multifunctional thiol resin, and (C) a calcium carbonate filler having a purity of 99% or more. The component (B) preferably contains a multifunctional thiol resin having no ester bond in the molecule. The resin composition more preferably further contains talc.
本发明提供了一种固化后具有高耐湿性可靠性(特别是耐湿性试验后具有高剪切强度)、可在低温下固化、具有光固化特性和热固化特性的树脂组合物。此外,还提供了含有该树脂组合物的粘合剂、该树脂组合物的固化产物、含有该固化产物的半导体器件以及含有该半导体器件的电子元件。树脂组合物包括 (A) 多功能(甲基)丙烯酸酯树脂,(B) 多功能硫醇树脂和 (C) 纯度为 99% 或以上的碳酸钙填料。组分(B)最好含有分子中没有酯键的多功能硫醇树脂。树脂组合物最好还含有滑石粉。