Polyamide ligand-containing polymeric resins and methods of using the same for removing, separating and/or concentrating desired metal ions from solutions
申请人:——
公开号:US20020042495A1
公开(公告)日:2002-04-11
The present invention is drawn to polyamide ligand-containing polymeric resins and methods of using the same for removing, separating, and/or concentrating certain desired metal ions from solutions, even when the desired ions are in the presence of other metal ions and/or hydrogen ions at much higher concentrations. The unique composition of matter of this invention is a polyamide ligand-containing polymeric resin which is a reaction product of a hydroxymethylated polyamide ligand and a polymerization and/or crosslinking agent. Specifically, the polymeric resins of the present invention are comprised of from 10 to 50,000 polyamide ligand units wherein each polyamide ligand unit contains at least three amide groups (preferably from three to eight amide groups) and two amine groups separated by at least two carbons. Each amide group, after polymerization, may remain hydroxymethylated or be crosslinked to other polyamide ligand units through a crosslinking agent.
本发明涉及含聚酰胺配体的聚合物树脂和使用这种树脂从溶液中去除、分离和/或浓缩某些所需金属离子的方法,即使所需离子与浓度高得多的其他金属离子和/或氢离子存在时也是如此。本发明的独特物质组合物是一种含聚酰胺配体的聚合物树脂,它是羟甲基化聚酰胺配体与聚合剂和/或交联剂的反应产物。具体来说,本发明的聚合树脂由 10 至 50,000 个聚酰胺配体单元组成,其中每个聚酰胺配体单元至少含有三个酰胺基团(最好是三至八个酰胺基团)和两个胺基团,两个胺基团之间至少有两个碳原子相隔。聚合后的每个酰胺基团可保持羟甲基化,或通过交联剂与其他聚酰胺配位单元交联。