Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate
申请人:SHIN-ETSU CHEMICAL CO., LTD.
公开号:US10197914B2
公开(公告)日:2019-02-05
The present invention provides a positive photosensitive resin composition containing (A) a polymer compound containing a siloxane chain, the polymer compound having a repeating unit shown by the general formula (1) and a weight average molecular weight of 3,000 to 500,000, (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinking agent, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination caused on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when a widely used 2.38% TMAH aqueous solution is used as the developer.
本发明提供了一种含有(A)含有硅氧烷链的聚合物化合物的阳性感光树脂组合物,该聚合物化合物具有由通式(1)所示的重复单元和重量平均分子量为3,000至500,000,(B)能够通过光生成酸并增加在水性碱性溶液中的溶解速率的感光材料,(C)交联剂和(D)溶剂。可以提供一种阳性感光树脂组合物,可以解决在金属线路(如Cu和Al)、电极和基板上引起的剥离问题,特别是在SiN等基板上,可以在使用广泛的2.38%TMAH水溶液作为显影剂时,在图案底部和基板上形成具有前向锥形形状的细微图案,而不会产生污点和底部轮廓。