2-p-tolyl-4,5-dihydroxymethyl imidazole | 61698-35-9

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 2-p-tolyl-4,5-dihydroxymethyl imidazole
• 英文别名: [2-(4-Methylphenyl)-1H-imidazole-4,5-diyl]dimethanol；[4-(hydroxymethyl)-2-(4-methylphenyl)-1H-imidazol-5-yl]methanol
• CAS: 61698-35-9
• 化学式: C₁₂H₁₄N₂O₂
• 分子量: 218.255
• InChiKey: AATODONPOVNXKH-UHFFFAOYSA-N

物化性质

• 沸点：
  512.5±50.0 °C(Predicted)
• 密度：
  1.282±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  0.4
• 重原子数：
  16
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  69.1
• 氢给体数：
  3
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  乙二醇甲醚 、 2-(4-甲基苯基)-1H-咪唑 在 potassium carbonate 、 paraformaldehyde 作用下， 以 甲苯 为溶剂， 以21%的产率得到2-p-tolyl-4,5-dihydroxymethyl imidazole
  参考文献：
  名称：

  Novel imidazole compounds and process for preparations thereof

  摘要：

  一种生产C-甲基醇咪唑的方法，包括将在2位含有芳基的咪唑化合物与甲醛在pH至少为7的反应介质中反应，从而使甲醛加到咪唑环的碳原子上。产物可以是单甲醇咪唑或双甲醇咪唑，取决于起始咪唑化合物。因此获得的大部分C-甲基醇咪唑是新化合物。

  公开号：

  US04104473A1

文献信息

• 2-Tolyl-4,5-dihydroxymethyl imidazole
  申请人：Shikoku Chemicals Corporation

  公开号：US04122277A1

  公开（公告）日：1978-10-24

  A process for producing C-methylol imidazoles which comprises reacting imidazole compounds containing an aryl group at the 2-position with formaldehyde in a reaction medium having a pH of at least 7 whereby the formaldehyde adds to the carbon atom of the imidazole ring. The products are either monomethylol imidazoles or dimethlol imidazoles depending upon the starting imidazole compounds. Most of the C-methylol imidazoles thus obtained are new compounds.

  一种制备C-甲基醛基咪唑的方法，包括将在2-位置含有芳基基团的咪唑化合物与甲醛在pH至少为7的反应介质中反应，从而使甲醛加到咪唑环的碳原子上。产物可以是单甲醛基咪唑或二甲醛基咪唑，这取决于起始咪唑化合物。因此获得的大多数C-甲基醛基咪唑都是新化合物。
• HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND METHOD FOR PRODUCING FIBER-REINFORCED COMPOSITE USING EACH OF SAME
  申请人：Toho Tenax Co., Ltd.

  公开号：EP3075785A1

  公开（公告）日：2016-10-05

  The present invention provides a heat-curable resin composition, which comprises (1) a heat-curable resin mixture comprising a heat-curable resin (a) and thickener particles (b) and exhibiting a viscosity (150°C) after having been held at a temperature of 150°C for 30 seconds that is a viscosity (S), and (2) a curing agent, and is characterized in that the heat-curable resin composition exhibits a lowest viscosity (R) at 80-120°C, the lowest viscosity (R) is 0.1-10 Pa·s, and the viscosity (S) and lowest viscosity (R) satisfy the relationship of formula (1): 5 < S/R < 200 ...formula (1).

  本发明提供了一种热固化树脂组合物，它包括(1)热固化树脂混合物，该混合物由热固化树脂(a)和增稠剂颗粒(b)组成，在150℃的温度下保持30秒后表现出粘度(S)，(2)固化剂，其特征在于热固化树脂组合物在80-120℃时表现出最低粘度(R)，最低粘度(R)为0.1-10 Pa-s，粘度 (S) 和最低粘度 (R) 满足式 (1) 的关系：5 < S/R < 200 ......式（1）。
• EPOXY RESIN COMPOSITION, PREPREG, CARBON FIBER-REINFORCED COMPOSITE MATERIAL, AND MANUFACTURING METHODS THEREFOR
  申请人：Toho Tenax Co., Ltd.

  公开号：EP3279263A1

  公开（公告）日：2018-02-07

  The present invention provides an epoxy resin composition comprising at least the following component [A], component [B] and component [C], the epoxy resin composition being characterized in that: the mixture of component [A] and component [B] is a mixture that, when temperature is increased at 2°C/min, begins to thicken at temperature (T1) and completes thickening at temperature (T2), temperature (T1) being 80-110°C and temperature (T1) and temperature (T2) satisfying the relationship of expression (1) 5°C ≤ (T2-T1) ≤ 20°C expression (1); and the mixture of component [A] and component [C] is a mixture that, when temperature is increased at 2°C/min, begins to cure at temperature (T3), temperature (T1) and temperature (T3) satisfying the relationship of expression (2) 5°C ≤ (T3-T1) ≤ 80°C expression (2). Component [A]: epoxy resin Component [B]: thickening particle Component [C]: curing agent

  本发明提供了一种环氧树脂组合物，至少包括下列组分[A]、组分[B]和组分[C]，该环氧树脂组合物的特征在于：组分[A]和组分[B]的混合物，当温度以2℃/分钟的速度升高时，在温度(T1)时开始增稠，在温度(T2)时完成增稠，温度(T1)为80-110℃，温度(T1)和温度(T2)满足表达式(1)5℃≤(T2-T1)≤20℃表达式(1)的关系；组分[A]和组分[C]的混合物，当温度以 2℃/分钟的速度升高时，开始固化的温度（T3）、温度（T1）和温度（T3）满足表达式（2）的关系 5℃≤（T3-T1）≤80℃ 表达式（2）。 组分 [A]：环氧树脂 组分 [B]：增稠粒子 组分 [C]：固化剂
• SELF-ADHESIVE PREPREG AND METHOD FOR PRODUCING SAME
  申请人：Teijin Limited

  公开号：EP3603915A1

  公开（公告）日：2020-02-05

  The present invention provides a self-adhesive prepreg which is characterized by comprising: a base prepreg that is composed of reinforcing fibers and a thermosetting resin composition (I), some or all of which is impregnated into a reinforcing fiber layer that is formed of the reinforcing fibers; an adhesive layer that is composed of a nonwoven fabric which is laminated on at least one surface of the base prepreg so as to be integrated with the base prepreg and a thermosetting resin composition (II) which is laminated on the surface of the nonwoven fabric so as to be integrated with the nonwoven fabric.

  本发明提供了一种自粘预浸料，其特征在于包括基体预浸料，由增强纤维和热固性树脂组合物 (I) 组成，其中部分或全部浸渍在由增强纤维形成的增强纤维层中； 粘合层，由无纺布和热固性树脂组合物 (II) 组成，无纺布层压在基体预浸料的至少一个表面上，以便与基体预浸料融为一体，热固性树脂组合物 (II) 层压在无纺布的表面上，以便与无纺布融为一体。
• MOLDING MATERIAL AND FIBER-REINFORCED COMPOSITE MATERIAL
  申请人：Mitsubishi Chemical Corporation

  公开号：EP3632982A1

  公开（公告）日：2020-04-08

  A molding material that enables acquirement of a fiber-reinforced composite material which has excellent demoldability from a mold and excellent surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance; and a fiber-reinforced composite material which has excellent demoldability from a mold and surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance, are provided. A molding material of the present invention includes a component (A): an epoxy resin; a component (B): an epoxy resin curing agent; a component (C): a compound that has a solubility parameter of 11.2 or less and a melting point of 115°C or lower; and a reinforcement fiber.

  本发明提供了一种成型材料，该材料可获得从模具脱模性和表面外观优异、成型后对模具表面污染少、机械性能和耐热性优异的纤维增强复合材料；以及一种从模具脱模性和表面外观优异、成型后对模具表面污染少、机械性能和耐热性优异的纤维增强复合材料。本发明的一种成型材料包括组分（A）：环氧树脂；组分（B）：环氧树脂固化剂；组分（C）：溶解度参数为 11.2 或以下、熔点为 115°C 或以下的化合物；以及增强纤维。