Adhesive films in which an epoxy resin composition comprising the following components (A) to (C): (A) an aromatic epoxy resin having two or more epoxy groups in a molecule; (B) a cyanate compound having two or more cyanato groups in a molecule; and (C) a phenoxy resin having a weight average molecular weight of from 5,000 to 100,000, is laminated on a support film, and a prepreg in which a sheet-like reinforcing base material made of a fiber is impregnated with the epoxy resin composition comprising the components (A) to (C) are excellent for forming insulation layers in multilayer printed circuit boards.
胶膜,其中环氧
树脂组合物包括以下组分(A)至(C):(A) 分子中含有两个或两个以上环氧基团的芳香族环氧
树脂;(B) 分子中含有两个或两个以上
氰基的
氰酸酯化合物;(C) 重量平均分子量为 5,000 至 100,000 的苯氧
树脂,层压在支撑薄膜上的预浸料,以及由纤维制成的片状增强基材浸渍在由(A)至(C)组分组成的环氧
树脂组合物中的预浸料,非常适用于在多层印刷电路板中形成绝缘层。