申请人:W.R. Grace & Co.-Conn.
公开号:EP0124808A1
公开(公告)日:1984-11-14
This invention reiates to a reactive plastisol dispersion composition comprising
(1) at least one polyvinyl acetal thermoplast in powder form, which is insoluble in the plasticizer at room temperature and plasticizable at a temperature at or above fluxing temperature, and which thermoplast has a flow temperature at 1,000 psi of between 100° and 200°C;
(2) a liquid plasticizer comprising an epoxide resin having on average more than one epoxide group in the molecule or a mixture of said epoxide resins in combination with a member of the group consisting of
(a) at least one ethylenically unsaturated monomer, oligomer or prepolymer of the formula:
wherein R is H or CH3, R, is an organic moiety and n is 1 or more,
(b) at least one unsaturated polyester containing the group:
wherein R2 and R3 are organic moieties, x is 0-20 and y is 1-20 and y is 1-20, and
(c) a mixture of (a) and (b);
(3) an effective amount of a latent curing agent for said epoxide resin, which is inactive in the epoxide resin at room temperature and which is selected from the group consisting of dicyandiamide, melamine,guanamine, polycarboxylic acid polyhydrazides, carboxylic acid imides, imidazole derivatives, BF3 adducts and diaryliodonium salts;
and, optionally,
(4) a curing agent for the plasticizer group member comprising a free radical thermal initiator.
The plastisol dispersion after fluxing can form a thermoset sealant, coating or adhesive on exposure to heat.
本发明涉及一种反应性塑溶胶分散体组合物,其中包括
(1) 至少一种粉末状的聚乙烯醇缩醛热塑性塑料,它在室温下不溶于增塑剂,在助熔温度或更高的温度下可增塑,该热塑性塑料在 1,000 psi 下的流动温度在 100° 至 200°C 之间;
(2) 液体增塑剂,包括分子中平均含有一个以上环氧基团的环氧树脂或上述环氧 树脂的混合物,并与以下组成成分结合使用
(a) 至少一种乙烯基不饱和单体、低聚物或预聚物,其式如下
其中 R 为 H 或 CH3,R 为有机分子,n 为 1 或更多、
(b) 至少一种含有以下基团的不饱和聚酯:
其中 R2 和 R3 为有机分子,x 为 0-20,y 为 1-20,以及
(c) (a)和(b)的混合物;
(3) 有效量的用于所述环氧树脂的潜伏固化剂,该固化剂在室温下在环氧树脂中不活跃,且选 自二氰胺、三聚氰胺、胍胺、聚羧酸多酰肼、羧酸酰亚胺、咪唑衍生物、BF3 加合物和二元碘鎓盐组成的组;
以及
(4) 用于增塑剂基团成员的固化剂,包括自由基热引发剂。
经过助熔处理的塑溶胶分散体受热后可形成热固性密封剂、涂层或粘合剂。