RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND PROCESS FOR MAKING RELIEF PRINTING PLATE
申请人:KAWASHIMA Takashi
公开号:US20120146264A1
公开(公告)日:2012-06-14
A resin composition for laser engraving is provided that includes a low molecular weight compound containing at least one type of polymerizable group selected from the group consisting of an ethylenically unsaturated group, an epoxy group, an oxetanyl group, a hydrolyzable silyl group, and a silanol group and further containing a sulfonamide group, a low molecular weight compound containing a residue selected from the group consisting of a maleimide group, a succinimide group, and a phthalimide group, or a polymer compound containing a constituent unit derived from a compound containing a maleimide group or a constituent unit containing a sulfonamide group.