Butylacrylate ethylacrylate acrylic acid

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: Butylacrylate ethylacrylate acrylic acid
• 英文别名: butyl prop-2-enoate;ethyl prop-2-enoate;prop-2-enoic acid
• 化学式: C15H24O6
• 分子量: 300.35
• InChiKey: FEGVAAWSWJUUPF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.51
• 重原子数：
  21
• 可旋转键数：
  9
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  89.9
• 氢给体数：
  1
• 氢受体数：
  6

反应信息

• 作为产物：
  描述：

  丙烯酸乙酯 、 丙烯酸丁酯 、 丙烯酸 、 在 lauryl 作用下， 反应 1.0h， 生成 Butylacrylate ethylacrylate acrylic acid
  参考文献：
  名称：

  Adhesive composition, process, and product

  摘要：

  专门用于绝缘窗组件的指令-治愈组合物，允许该组合物在组件形成后的选定时间间隔内被渲染成具有粘合性，以牢固粘合组件的对面表面；特定的带状或胶带形式的粘合剂包括一种透明于固化辐射，特别是紫外线的粘合聚合物组成物，可在辐射存在的情况下固化；固化受氧气抑制；该组合物无溶剂，固化后对水具有抵抗力；暴露于氧气的粘合剂表面仍然具有粘性且未固化；该粘合剂在窗结构中特别有用，其中粘性表面的粘合可排除抑制固化的氧气，并且粘性表面可以通过穿过窗玻璃的紫外线辐射固化。

  公开号：

  US04965117A1

文献信息

• Process for preparing silylated organic polymers and their use for treating textile materials
  申请人：SWS Silicones Corporation

  公开号：EP0048447A2

  公开（公告）日：1982-03-31

  Silylated organic polymers which may be applied to textile materials to impart hydrophilic properties thereto are prepared by reacting polymeric organic acids with silylated aminofunctional polyethers. The resultant composition may then be crosslinked to impart durable hydrophilic properties to textile materials treated therewith.

  硅烷化有机聚合物是通过聚合物有机酸与硅烷化氨基官能团聚醚反应制备的，可用于纺织材料以赋予其亲水性。然后，可对所得组合物进行交联，使经其处理的纺织材料具有持久的亲水性。
• Synthetic resin composition
  申请人：Toyoda Boshoku Corporation

  公开号：EP1008623A1

  公开（公告）日：2000-06-14

  The present invention is for providing a synthetic resin composition capable of effectively deodorizing amine malodor causing substances such as trimethyl amine. In a synthetic resin composition comprising an aqueous medium, a surfactant, and a polymer latex and a filler dispersed in the aqueous medium by the surfactant, a transitional metal supported silica gel having at least one selected from the group consisting of a transitional metal and a transitional metal compound supported by a silica gel and an activated carbon were used as the filler. Since the transitional metal or the transitional metal compound has an performs extremely well as a Lewis acid, it forms a complex with a Lewis base having an unpaired electron. That is, a malodor causing substance such as amines and ammonia having a nitrogen atom with an unpaired electron can be adsorbed efficiently.

  本发明旨在提供一种合成树脂组合物，能够有效地去除胺类恶臭物质，如三甲胺。合成树脂组合物由水介质、表面活性剂、聚合物胶乳和由表面活性剂分散在水介质中的填料组成，在合成树脂组合物中，使用了过渡金属支撑的硅胶作为填料，该硅胶具有至少一种从过渡金属和过渡金属化合物组成的组中选出的过渡金属，并由硅胶和活性炭支撑。由于过渡金属或过渡金属化合物具有极佳的路易斯酸性能，因此会与具有未配对电子的路易斯碱形成络合物。也就是说，可以有效地吸附导致恶臭的物质，如胺和具有未配对电子的氮原子的氨。
• Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tape
  申请人：Nitto Denko Corporation

  公开号：EP2639277A1

  公开（公告）日：2013-09-18

  The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame. In a preferred embodiment the pressure-sensitive adhesive layer at a side on which a semiconductor chip is not to be encapsulated with a resin comprises a heat-expandable pressure-sensitive adhesive containing heat-expandable micro spheres. In another preferred embodiment the ratio of a silicone rubber to a silicone resin in the silicone pressure-sensitive adhesive is from 95/5 to 20/80.

  本发明提供了一种用于生产半导体器件的耐热压敏胶带，包括基材层和形成在基材层两侧的压敏胶层，其中至少在半导体芯片需要用树脂封装的一侧的压敏胶层含有硅酮压敏胶。耐热压敏胶带用于在不使用金属引线框架的无基底半导体封装生产方法中临时固定芯片。 在一个优选的实施方案中，在半导体芯片不被树脂封装的一侧的压敏胶层包括一种含有热膨胀微球的热膨胀压敏胶。 在另一个优选的实施方案中，硅酮压敏胶中硅酮橡胶和硅酮树脂的比例为 95/5 至 20/80。
• Crosslinked pressure sensitive adhesive compositions, and adhesive articles based thereon , useful in high temperature applications
  申请人：——

  公开号：US20020132111A1

  公开（公告）日：2002-09-19

  Pressure sensitive adhesive compositions, and adhesive articles based thereon, crosslinked using a bis-amide crosslinking agent that are thermally stable, yet cleanly removable from a variety of substrates following exposure to high temperatures.

  使用双酰胺交联剂交联的压敏型粘合剂组合物及其粘合制品，具有热稳定性，但在暴露于高温后可从各种基材上清除。
• CROSSLINKED PRESSURE SENSITIVE ADHESIVE COMPOSITONS, AND ADHESIVE ARTICLES BASED THEREON, USEFUL IN HIGH TEMPERATURE APPLICATIONS
  申请人：3M Innovative Properties Company

  公开号：EP1341861B1

  公开（公告）日：2006-02-15