N,N-bis-(2-hydroxypropyl)-γ-hydroxy-butyramide | 66857-23-6

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: N,N-bis-(2-hydroxypropyl)-γ-hydroxy-butyramide
• 英文别名: 4-Hydroxy-N,N-bis(2-hydroxypropyl)butanamide
• CAS: 66857-23-6
• 化学式: C₁₀H₂₁NO₄
• 分子量: 219.281
• InChiKey: ZJPLCMWRYCEIQI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -1.2
• 重原子数：
  15
• 可旋转键数：
  7
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.9
• 拓扑面积：
  81
• 氢给体数：
  3
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  N,N-bis-(2-hydroxypropyl)-γ-hydroxy-butyramide 、 三氟化硼四氢呋喃络合物 、 sodium methylate 以 甲醇 、 四氢呋喃 为溶剂， 反应 13.0h， 以88%的产率得到
  参考文献：
  名称：

  CN114573620

  摘要：

  公开号：

文献信息

• Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition
  申请人：Park Jung-Dae

  公开号：US20060287207A1

  公开（公告）日：2006-12-21

  A composition for removing a photoresist includes about 5 to about 20 percent by weight of an alcoholamide compound, about 15 to about 60 percent by weight of a polar aprotic solvent, about 0.1 to about 6 percent by weight of an additive, and pure water. The alcoholamide compound is chemically structured as follows: where R 1 is a hydroxyl group or a hydroxyalkyl group, and R 2 is a hydrogen atom or a hydroxyalkyl group.
• COMPOSITION FOR REMOVING A PHOTORESIST, METHOD OF PREPARING THE COMPOSITION, METHOD OF REMOVING A PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE COMPOSITION
  申请人：PARK Jung-Dae

  公开号：US20100009885A1

  公开（公告）日：2010-01-14

  A composition for removing a photoresist includes about 5 to about 20 percent by weight of an alcoholamide compound, about 15 to about 60 percent by weight of a polar aprotic solvent, about 0.1 to about 6 percent by weight of an additive, and pure water. The alcoholamide compound is chemically structured as follows: where R 1 is a hydroxyl group or a hydroxyalkyl group, and R 2 is a hydrogen atom or a hydroxyalkyl group.
• US4143159A
  申请人：——

  公开号：US4143159A

  公开（公告）日：1979-03-06
• US7608540B2
  申请人：——

  公开号：US7608540B2

  公开（公告）日：2009-10-27
• US7687448B2
  申请人：——

  公开号：US7687448B2

  公开（公告）日：2010-03-30